公开(公告)号：US11664243B2

公开(公告)日：2023-05-30

申请号：US16440201

申请日：2019-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-jine Park ,  Seung-ho Lee ,  Bo-wo Choi ,  Yong-sun Ko ,  Woo-gwan Shim

IPC: H01L21/67

CPC classification number: H01L21/67063 ,  H01L21/67115 ,  H01L21/67259

Abstract: A substrate processing apparatus includes: a spin chuck, on which a substrate is mounted, the spin chuck rotating the substrate; At least one of a chemical liquid nozzle configured to provide a chemical liquid to a surface of the substrate and a deionzed water nozzle configured to provide a deionized water to a surface of the substrate; and a laser device configured to emit a pulse waver laser beam having a period of 10−9 seconds or less for etching an edge of the substrate.