公开(公告)号：US20250037486A1

公开(公告)日：2025-01-30

申请号：US18668890

申请日：2024-05-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinwoo LEE ,  Bumjoo LEE ,  Jongcheon SUN ,  Suyoung LEE ,  Hyeongcheol LEE

IPC: G06V20/69 ,  G06T7/00 ,  G06V10/764

Abstract: A method of generating a defect classification model includes preparing a sample wafer that has undergone at least one unit of a manufacturing process, capturing, using an electronic device, a plurality of primary images of different locations of the sample wafer, obtaining a plurality of secondary images based on the capturing of the plurality of primary images, detecting a plurality of defect images including a defect from among the plurality of primary images and the plurality of secondary images, classifying and labeling at least one of the plurality of defect images as defect data, and generating an automatic defect classification model based on the defect data.

公开(公告)号：US20240202879A1

公开(公告)日：2024-06-20

申请号：US18471504

申请日：2023-09-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinwoo LEE ,  Bumjoo LEE ,  Su-Young LEE

IPC: G06T5/50 ,  G06T5/00 ,  G06T7/11 ,  G06T7/62

CPC classification number: G06T5/50 ,  G06T5/002 ,  G06T7/11 ,  G06T7/62 ,  G06T2207/20132 ,  G06T2207/20216

Abstract: An image processing method includes generating a full image of an area of interest in which unit patterns are repeatedly arranged, blurring each of the unit patterns, calculating respective center positions of each of the unit patterns based on the blurring, setting respective reference positions on each of the unit patterns based on the center positions, cropping the full image into a plurality of unit images, and merging the plurality of unit images based on the reference positions to generate an averaged image.

公开(公告)号：US20250014169A1

公开(公告)日：2025-01-09

申请号：US18644638

申请日：2024-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumjoo LEE ,  Jinwoo LEE ,  Suyoung LEE

IPC: G06T7/00 ,  G06T5/20 ,  G06T5/70 ,  G06T7/11

Abstract: A defect inspection method includes: recognizing image peaks that are reference positions of image patterns included an inspection image; performing filtering on a reference image including reference patterns, recognizing reference peaks, and then selecting some of the reference peaks as peak samples; calculating candidate correction constants by overlapping the filtered inspection image and the filtered reference image, and then selecting a primary correction constant among the candidate correction constants; applying the first correction constant to the reference image and selecting a secondary correction constant by matching the image peaks to the reference peaks included in a primary corrected reference image, and then applying the secondary correction constant to the primary corrected reference image and forming a secondary corrected reference image aligned with the inspection image; and performing a defect inspection on the inspection image by matching the image patterns to reference patterns included in the secondary corrected reference image.