公开(公告)号：US20180144998A1

公开(公告)日：2018-05-24

申请号：US15626302

申请日：2017-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Won PARK ,  Jeong-Su HA ,  Sangbong PARK ,  Kwang Soo KIM ,  Byeong Kyu CHA

IPC: H01L21/66 ,  G01N21/88 ,  G01N21/95 ,  G06T7/00 ,  H04N7/18

CPC classification number: H01L22/20 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887 ,  G06T7/0004 ,  G06T2207/10056 ,  G06T2207/30148 ,  H01L22/12 ,  H04N7/181

Abstract: Disclosed are an inspection apparatus and a method of manufacturing a semiconductor device using the same. The inspection apparatus includes a stage configured to receive a substrate, an objective lens on the stage and configured to enlarge the substrate optically, an ocular lens on the objective lens and configured to form at its image plane an image of the substrate, and a plurality of sensors above the ocular lens and in the image plane of the ocular lens.