公开(公告)号：US20240186278A1

公开(公告)日：2024-06-06

申请号：US18457785

申请日：2023-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masato KAJINAMI ,  Hansung CHO ,  Kazuya ONO ,  Byeongjin KIM ,  Daisuke NAGATOMO ,  Fumitaka MOROISHI ,  Masanori IZUMITA ,  Sungmin AHN

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L24/74 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/80 ,  H01L2224/74 ,  H01L2224/80895 ,  H01L2924/40

Abstract: Provided are mounting devices and mounting methods configured to realize high-precision mounting. A mounting device including a bonding actuator having a housing, a slider accommodated in the housing in a non-contact state and provided with a head, a coil and a yoke in a non-contact state, two voice coil motors (VCMs) driven in an X-axis direction, three VCMs driven in a Y-axis direction, and one VCM driven in a Z-axis direction may be provided. The coil may be fixed to the housing and the yoke may be fixed to the slider. The bonding actuator may perform bonding while adjusting a relative position and parallelism of a chip and a wafer, by driving the slider in six axial directions, which include the X-axis direction, the Y-axis direction, the Z-axis direction, a Tx direction, a Ty direction, and a Tz direction.