公开(公告)号：US20040040696A1

公开(公告)日：2004-03-04

申请号：US10645116

申请日：2003-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung-il Cho ,  Byeoung-ju Ha ,  Young-ki Hong ,  Tae-gyun Kim ,  Jong-beom Kim

IPC: F28D015/00

CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28F2210/02 ,  F28F2245/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A substantially flat heat transferring device and a method of fabricating the same are provided. The device includes a lower plate, an upper plate, a wick plate, and a liquid-phase coolant, while the lower plate contacts a heat source at its bottom. The upper plate is hermetically coupled with the lower plate along its edge to form a void therebetween. The wick plate is provided between the upper plate and the lower plate and is maintained in position relative to the lower plate by surface tension of the liquid-phase coolant. The liquid-phase coolant transfers heat by circulating between a vaporization part, where the heat source is located, to a condensing part. Here, the wick plate includes a plurality of holes and a plurality of planar wicks and makes the liquid-phase coolant flow from the condensing part to the vaporization part by capillary force between itself and the lower plate.

Abstract translation: 提供了基本平坦的传热装置及其制造方法。 该装置包括下板，上板，芯板和液相冷却剂，而下板在其底部接触热源。 上板沿其边缘与下板气密耦合以在它们之间形成空隙。 芯板设置在上板和下板之间，并且通过液相冷却剂的表面张力相对于下板保持在适当位置。 液相冷却剂通过在热源所在的蒸发部分之间循环到冷凝部分来传递热量。 这里，芯板包括多个孔和多个平面灯芯，并且通过其本身与下板之间的毛细管力使液相冷却剂从冷凝部件流到蒸发部。

公开(公告)号：US20040257171A1

公开(公告)日：2004-12-23

申请号：US10825608

申请日：2004-04-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Kwon Park ,  In-sang Song ,  Byeoung-ju Ha ,  Il-jong Song ,  Duck-hwan Kim

IPC: H03H009/70

CPC classification number: H03H9/173 ,  H03H3/02 ,  H03H9/02133 ,  H03H9/0571 ,  H03H9/587 ,  H03H9/706 ,  Y10T29/42

Abstract: An air-gap type film bulk acoustic resonator (FBAR) is created by securing two substrate parts, one providing a resonance structure and the other providing a separation structure, i.e., a cavity. When the two substrate parts are secured, the resonance structure is over the cavity, forming an air gap isolating the resonant structure from the support substrate. The FBAR may be used to form a duplexer, which includes a plurality of resonance structures, a corresponding plurality of cavities, and an isolation part formed between the cavities. The separate creation of the resonance structures and the cavities both simplifies processing and allows additional elements to be readily integrated in the cavities.

Abstract translation: 通过固定两个基板部分，一个提供谐振结构，另一个提供分离结构，即空腔，形成气隙型膜体声波谐振器（FBAR）。 当固定两个基板部分时，谐振结构在空腔之上，形成将谐振结构与支撑基板隔离的气隙。 FBAR可以用于形成双工器，其包括多个谐振结构，相应的多个空腔和形成在腔之间的隔离部分。 谐振结构和空腔的独立创建既简化了处理，并允许额外的元件容易地集成在空腔中。