公开(公告)号：US20240128229A1

公开(公告)日：2024-04-18

申请号：US18337860

申请日：2023-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungkeun Kang ,  Chaein Moon ,  Youngja Kim ,  Youngmin Lee

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75272 ,  H01L2224/75704 ,  H01L2224/75803 ,  H01L2224/75804 ,  H01L2924/40

Abstract: A solder reflow apparatus may include a reflow chamber, a heater and a stage. The reflow chamber may be configured to receive a heat transfer fluid. The heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. The heater may be configured to heat the heat transfer fluid in the reflow chamber. The stage may be in the reflow chamber to support the substrate. The stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. Thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.