公开(公告)号：US12237297B2

公开(公告)日：2025-02-25

申请号：US18127513

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junga Lee ,  Youngja Kim ,  Hyunki Kim ,  Youngmin Lee

IPC: B23K3/00 ,  B23K1/00 ,  B23K1/015 ,  B23K3/047 ,  B23K3/08 ,  H01L23/00 ,  B23K101/40

Abstract: An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

公开(公告)号：US20250167166A1

公开(公告)日：2025-05-22

申请号：US19027974

申请日：2025-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junga LEE ,  Youngja Kim ,  Hyunki Kim ,  Youngmin Lee

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/015 ,  B23K3/047 ,  B23K3/08 ,  B23K101/40

Abstract: An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

公开(公告)号：US20240120310A1

公开(公告)日：2024-04-11

申请号：US18202128

申请日：2023-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngja Kim

IPC: H01L23/00 ,  B08B3/12

CPC classification number: H01L24/75 ,  B08B3/12 ,  H01L24/83 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/83815 ,  H01L2224/83912

Abstract: A solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. The solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. The condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. The condensation apparatus may condensate a gas generated from the heat transfer fluid to convert the gas into a liquid. The cleaning apparatus may be configured to clean the semiconductor package processed by the condensation apparatus using a cleaning agent. Thus, the heat transfer fluid stained with the semiconductor package may be removed by the condensation apparatus so that the heat transfer fluid may not be introduced into the cleaning apparatus. As a result, the heat transfer fluid may not be mixed with the cleaning agent to maintain cleaning capacity of the cleaning agent.

公开(公告)号：US20250046750A1

公开(公告)日：2025-02-06

申请号：US18923356

申请日：2024-10-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngja Kim

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/015 ,  B23K3/047 ,  B23K3/08 ,  B23K101/40 ,  H01L21/56

Abstract: A method of manufacturing an electronic device includes: providing a vapor generating chamber that accommodates a heat transfer fluid; providing a substrate stage within the vapor generating chamber, the substrate stage including a seating surface and suction passages penetrating the substrate stage to be open to the seating surface; loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps; generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface; heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber; and soldering the bumps using the saturated vapor.

公开(公告)号：US12208541B2

公开(公告)日：2025-01-28

申请号：US17746454

申请日：2022-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngja Kim ,  Hyunggil Baek ,  Younhwan Shin

IPC: B28D5/02 ,  C01B32/25

Abstract: A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.

公开(公告)号：US20240207961A1

公开(公告)日：2024-06-27

申请号：US18243805

申请日：2023-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngja Kim

IPC: B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0623 ,  H05K3/34 ,  B23K2101/42

Abstract: A ball attachment apparatus includes a tool case having a bottom surface on which solder balls are adsorbed for attachment to a substrate strip including a plurality of substrate units, a plurality of holding tools in the tool case spaced apart from each other in a first direction, including a plurality of holding regions disposed in the tool case each including adsorption holes, the holding regions respectively corresponding to the substrate units and the adsorption holes respectively corresponding to ball pads of the substrate units, and a plurality of insertion blocks respectively disposed between adjacent ones of the holding tools, wherein, among gaps between the holding tools, a first gap at a first distance from a center of the tool case is different from at least one second gap at a second distance greater than the first distance from the center of the tool case.

公开(公告)号：US20240355640A1

公开(公告)日：2024-10-24

申请号：US18436934

申请日：2024-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngja Kim ,  Minwoo Jeon

IPC: H01L21/48 ,  B23K1/012 ,  B23K101/40 ,  H01L21/67

CPC classification number: H01L21/4853 ,  B23K1/012 ,  H01L21/4867 ,  H01L21/67109 ,  B23K2101/40

Abstract: In a method of manufacturing an electronic device, a substrate including a plurality of bonding pads on a first surface thereof is provided. Solder members are attached on the plurality of bonding pads respectively. An airflow control cover is positioned on the first surface of the substrate above the solder members, the airflow control cover including a plurality of vapor passage holes that allows air to flow toward the solder members. The substrate on which the airflow control cover is positioned is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. The heat transfer fluid is heated to place the heat transfer fluid in a vapor state within the chamber. The solder members are soldered by supplying the heat transfer fluid in the vapor state to surfaces of the solder members through the vapor passage holes of the airflow control cover.

公开(公告)号：US20240170448A1

公开(公告)日：2024-05-23

申请号：US18470082

申请日：2023-09-19

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Sanghyeon Jeong ,  Youngja Kim ,  Junga Lee ,  Donguk Kwon

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/3511

Abstract: A method of manufacturing a semiconductor package includes applying a plurality of forces to a plurality of points of a semiconductor chip through a plurality of elastic members, and bonding the semiconductor chip to an object while the plurality of forces are applied to the plurality of points of the semiconductor chip through the plurality of elastic members, wherein the plurality of elastic members are configured such that the plurality of forces are different from each other, and the plurality of forces flatten the semiconductor chip.

公开(公告)号：US20230180381A1

公开(公告)日：2023-06-08

申请号：US18071903

申请日：2022-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kanggyune Lee ,  Hyunggil Baek ,  Youngja Kim ,  Seungjin Lee

IPC: H05K1/02 ,  H01L23/544 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K1/0269 ,  H01L23/544 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L25/105 ,  H01L2223/54426 ,  H05K1/113

Abstract: A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrate base; and at least one alignment mark disposed on the surface of the substrate base to be spaced apart from the ball lands and exposed to the outside, wherein top surfaces of the ball lands and a top surface of the at least one alignment mark are at substantially the same vertical level and the ball lands and the at least one alignment mark include the same material.

公开(公告)号：US12154882B2

公开(公告)日：2024-11-26

申请号：US18126858

申请日：2023-03-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngja Kim

IPC: B23K3/00 ,  B23K1/00 ,  B23K1/015 ,  B23K3/047 ,  B23K3/08 ,  H01L23/00 ,  B23K101/40 ,  H01L21/56

Abstract: A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.