公开(公告)号：US10194521B2

公开(公告)日：2019-01-29

申请号：US15616420

申请日：2017-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyuwon Kim ,  Jeeyoung Jung ,  Jongkil Park ,  Byungsu Lee ,  Jiwoo Lee

IPC: H05K1/02 ,  H04M1/02 ,  H05K9/00 ,  H02J7/02 ,  H05K5/00 ,  G06F1/20 ,  H05K7/20

Abstract: A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the heat generation body, and a coil FPCB attached between the internal support structure and the shield can, wherein the internal support structure includes an air volume space configured to block conduction of high-temperature heat produced by the heat generation body and cause thermal radiation and convection.

公开(公告)号：US20180035528A1

公开(公告)日：2018-02-01

申请号：US15616420

申请日：2017-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyuwon KIM ,  Jeeyoung Jung ,  Jongkil Park ,  Byungsu Lee ,  Jiwoo Lee

IPC: H05K1/02 ,  H02J7/02 ,  H05K5/00

CPC classification number: H05K1/0203 ,  G06F1/20 ,  H02J7/025 ,  H04M1/0262 ,  H05K1/028 ,  H05K5/0017 ,  H05K7/20127 ,  H05K9/0033

Abstract: A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the heat generation body, and a coil FPCB attached between the internal support structure and the shield can, wherein the internal support structure includes an air volume space configured to block conduction of high-temperature heat produced by the heat generation body and cause thermal radiation and convection.