公开(公告)号：US20230191555A1

公开(公告)日：2023-06-22

申请号：US17940403

申请日：2022-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chaelyoung Kim ,  Jinyoung Park ,  Jaehyug Lee ,  Hoyoung Kim

IPC: B24B37/04 ,  B24B37/10 ,  B24B57/02 ,  H01L21/3105

CPC classification number: B24B37/046 ,  B24B37/105 ,  B24B37/044 ,  B24B57/02 ,  H01L21/31053 ,  H01L21/3212

Abstract: A chemical mechanical polishing apparatus, includes: a platen having a polishing pad attached to an upper surface thereof, and rotatably installed in one direction by a driving means, a slurry supply unit supplying a slurry including an abrasive and an additive having a zeta potential of a first polarity to the polishing pad, an electrode disposed below the polishing pad, a power supply unit applying a voltage including a DC pulse of a second polarity, opposite to the first polarity, to the electrode, and a polishing head installed on the polishing pad, and rotating a semiconductor substrate in contact with the polishing pad.