公开(公告)号：US10819011B2

公开(公告)日：2020-10-27

申请号：US15991504

申请日：2018-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han Bin Lee ,  Jae Hyung Kim ,  Hua Li ,  Je Sun Moon ,  Jin Kyu Bang ,  Chang Ha Yu ,  Sung Yeul Hong

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q13/10 ,  H01Q5/335 ,  H01Q21/28

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing the first plate, and a side member surrounding a space between the first plate and the second plate and a circuit board, which is accommodated inside a housing and in which a wireless communication circuit is disposed. The second plate includes a slot filled with a non-conductive material. An area other than the slot is formed of a conductive material. The circuit board includes a conductive pattern formed on the circuit board along with the slot of the second plate, and the wireless communication circuit is configured to feed one point of the second plate adjacent to the slot to receive a signal of a first frequency band through an electrical path formed by the slot and to feed the conductive pattern to receive a signal of a second frequency band through the slot.

公开(公告)号：US20180342793A1

公开(公告)日：2018-11-29

申请号：US15991504

申请日：2018-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han Bin LEE ,  Jae Hyung Kim ,  Hua Li ,  Je Sun Moon ,  Jin Kyu Bang ,  Chang Ha Yu ,  Sung Yeul Hong

IPC: H01Q1/24 ,  H01Q13/10 ,  H01Q1/22 ,  H01Q1/38

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing the first plate, and a side member surrounding a space between the first plate and the second plate and a circuit board, which is accommodated inside a housing and in which a wireless communication circuit is disposed. The second plate includes a slot filled with a non-conductive material. An area other than the slot is formed of a conductive material. The circuit board includes a conductive pattern formed on the circuit board along with the slot of the second plate, and the wireless communication circuit is configured to feed one point of the second plate adjacent to the slot to receive a signal of a first frequency band through an electrical path formed by the slot and to feed the conductive pattern to receive a signal of a second frequency band through the slot.