公开(公告)号：US11769946B2

公开(公告)日：2023-09-26

申请号：US16344172

申请日：2017-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Hyung Kim ,  Kyung Bae Ko ,  Tae Gyu Kim ,  Je Sun Moon ,  Jin Kyu Bang ,  Sang Hoon Lee

IPC: H01Q5/30 ,  H05K7/14 ,  H05K5/00 ,  H05K5/02 ,  H04B1/3827 ,  H01Q5/364 ,  H01Q1/24 ,  H01Q13/10 ,  H01Q1/38

CPC classification number: H01Q5/30 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q5/364 ,  H01Q13/10 ,  H04B1/3827 ,  H05K5/0086 ,  H05K5/0226 ,  H05K7/1427

Abstract: An electronic device according to an embodiment may comprise: a housing including a first slit having a length corresponding to a first frequency and a second slit extending from one point of the first slit in a different direction from the first slit and having a length corresponding to a second frequency, and configured to resonate at the first frequency and the second frequency by the first slit and the second slit; a printed circuit board disposed in the housing and at least partially made of a non-conductive material in regions corresponding to the first slit and the second slit; and a power supply unit for supplying power through one point of the housing, adjacent to the first slit or the second slit. Various other embodiments recognized from the specification are also possible.

公开(公告)号：US10819011B2

公开(公告)日：2020-10-27

申请号：US15991504

申请日：2018-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han Bin Lee ,  Jae Hyung Kim ,  Hua Li ,  Je Sun Moon ,  Jin Kyu Bang ,  Chang Ha Yu ,  Sung Yeul Hong

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q13/10 ,  H01Q5/335 ,  H01Q21/28

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing the first plate, and a side member surrounding a space between the first plate and the second plate and a circuit board, which is accommodated inside a housing and in which a wireless communication circuit is disposed. The second plate includes a slot filled with a non-conductive material. An area other than the slot is formed of a conductive material. The circuit board includes a conductive pattern formed on the circuit board along with the slot of the second plate, and the wireless communication circuit is configured to feed one point of the second plate adjacent to the slot to receive a signal of a first frequency band through an electrical path formed by the slot and to feed the conductive pattern to receive a signal of a second frequency band through the slot.

公开(公告)号：US20180342793A1

公开(公告)日：2018-11-29

申请号：US15991504

申请日：2018-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han Bin LEE ,  Jae Hyung Kim ,  Hua Li ,  Je Sun Moon ,  Jin Kyu Bang ,  Chang Ha Yu ,  Sung Yeul Hong

IPC: H01Q1/24 ,  H01Q13/10 ,  H01Q1/22 ,  H01Q1/38

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing the first plate, and a side member surrounding a space between the first plate and the second plate and a circuit board, which is accommodated inside a housing and in which a wireless communication circuit is disposed. The second plate includes a slot filled with a non-conductive material. An area other than the slot is formed of a conductive material. The circuit board includes a conductive pattern formed on the circuit board along with the slot of the second plate, and the wireless communication circuit is configured to feed one point of the second plate adjacent to the slot to receive a signal of a first frequency band through an electrical path formed by the slot and to feed the conductive pattern to receive a signal of a second frequency band through the slot.