公开(公告)号：US11114747B2

公开(公告)日：2021-09-07

申请号：US16441376

申请日：2019-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chungkyun Ham ,  Seunggil Jeon ,  Jaehun Jung ,  Youngsik Kim

IPC: H01Q1/24 ,  H01Q9/06 ,  H01Q9/42 ,  H01Q5/42 ,  H01Q21/28 ,  H01Q21/06 ,  H05K1/16

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a first PCB disposed in parallel with the first plate in the space between the first plate and the second plate, and including a first face facing the first plate and a second face facing the second plate, at least one conductive plate formed on the second face, a first conductive pattern embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate, a first wireless communication circuit mounted on a first face of the first PCB, electrically coupled to the conductive plate and the first conductive pattern.