Electronic device including heat dissipation structure

    公开(公告)号:US11388841B2

    公开(公告)日:2022-07-12

    申请号:US17266355

    申请日:2019-06-24

    Abstract: An electronic device according to various embodiments of the disclosure includes: a housing including a plurality of acoustic holes; an enclosure mounted in the housing; at least one heating element disposed in the enclosure; a heat dissipation structure disposed on the heating element to transfer heat generated from the heating element; and a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring the heat transferred from the heat dissipation structure to the outside through the acoustic holes. The heat dissipation structure may include: at least one first heat transfer member coupled to the one heating element; and a second heat transfer member disposed at least partially on the first heat transfer member to transfer, to the heat dissipation duct, heat transferred from the first heat transfer member.

    WEARABLE DEVICE FOR DETECTING BIOMETRIC INFORMATION OF USER

    公开(公告)号:US20250076982A1

    公开(公告)日:2025-03-06

    申请号:US18736119

    申请日:2024-06-06

    Abstract: According to an embodiment, a wearable device includes a housing including a first surface configured to contact a first body part of a user in a state in which the wearable device is worn on the first body part, a second surface opposite to the first surface, and a groove recessed from the second surface toward the first surface. The wearable device includes a first sensor in the housing disposed toward the groove. The first sensor is configured to detect a second body part of the user, distinct from the first body part of the user, positioned in the groove.

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