公开(公告)号：US11848279B2

公开(公告)日：2023-12-19

申请号：US17585913

申请日：2022-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehee Nam ,  Yanghwan Kim ,  Dongkil Choi ,  Jeongho Kang

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/552 ,  H01L23/49822 ,  H01L23/49838 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06548 ,  H01L2225/06572

Abstract: Certain embodiments of the disclosure relate to an electronic device including a substrate having a shielding structure. The electronic device may include a first substrate, a second substrate, and a third substrate. The second substrate may include a first metal pattern connected to ground and including multiple first slits formed by removing a portion of the first metal pattern, each of the first slits having a cross shape, a second metal pattern connected to the ground and including multiple second slits formed by removing a portion of the second metal pattern, each of the second slits having the cross shape, and multiple ground vias extending through at least a portion of the second substrate so as to connect the first metal pattern of the first metal layer to the second metal pattern of the second metal layer. Various other embodiments are also disclosed.