公开(公告)号：US11848279B2

公开(公告)日：2023-12-19

申请号：US17585913

申请日：2022-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehee Nam ,  Yanghwan Kim ,  Dongkil Choi ,  Jeongho Kang

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/552 ,  H01L23/49822 ,  H01L23/49838 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06548 ,  H01L2225/06572

Abstract: Certain embodiments of the disclosure relate to an electronic device including a substrate having a shielding structure. The electronic device may include a first substrate, a second substrate, and a third substrate. The second substrate may include a first metal pattern connected to ground and including multiple first slits formed by removing a portion of the first metal pattern, each of the first slits having a cross shape, a second metal pattern connected to the ground and including multiple second slits formed by removing a portion of the second metal pattern, each of the second slits having the cross shape, and multiple ground vias extending through at least a portion of the second substrate so as to connect the first metal pattern of the first metal layer to the second metal pattern of the second metal layer. Various other embodiments are also disclosed.

公开(公告)号：US10778178B2

公开(公告)日：2020-09-15

申请号：US15899121

申请日：2018-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon Ghim ,  Jeongho Kang ,  Namwoo Kim ,  Yunbum Lee ,  Haimin Lee

IPC: H03H7/46 ,  H04B1/00 ,  H04B1/28 ,  H04W88/02 ,  H04W72/04 ,  H04W8/00 ,  H04B1/403

Abstract: A front end module supporting a plurality of frequency bands and an electronic device includes a plurality of duplexers, a first switch configured to connect any one of the plurality of duplexers to an antenna, a second switch configured to connect a first port, to which a Tx signal of a first communication or a Tx signal of a second communication is input, to any one of Tx ports of the plurality of duplexers, and to connect a second port, from which a Rx signal of the second communication is output, to one of the Tx ports of the plurality of duplexers. According to certain embodiments, the number of switches occupying a large space can be minimized, and thus a space occupied by the front end module supporting device to device (D2D) communication can be reduced.

公开(公告)号：US11881647B2

公开(公告)日：2024-01-23

申请号：US17250491

申请日：2019-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon Ghim ,  Jeongho Kang ,  Youngmin Lee ,  Yunbum Lee ,  Seongbeom Hong

IPC: H01R12/79 ,  H01P3/08 ,  H04B1/00 ,  H04M1/02

CPC classification number: H01R12/79 ,  H01P3/08 ,  H04B1/0071 ,  H04M1/0274

Abstract: The disclosure relates to an apparatus for connecting modules included in an electronic device, and the apparatus may comprise: a power source between a first module of an electronic device and a second module of the electronic device; at least one line unit including lines for transferring a control signal, an intermediate (IF) signal, or a radio frequency (RF) signal; a first connector unit for connecting at least one of the lines to the first module; a second connector unit for connecting at least one of the lines to the second module; and a connection unit for connecting at least one external apparatus and at least one line for transferring the IF signal or the RF signal from among the lines.