公开(公告)号：US20140268170A1

公开(公告)日：2014-09-18

申请号：US14101741

申请日：2013-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Cheon Sun ,  Jeong-Ho Ahn ,  Dong-Ryul Lee ,  Dong-Chul Ihm

IPC: G01B11/22

CPC classification number: G01N21/9505

Abstract: Provided are an apparatus and a method for estimating a depth of a buried defect in a substrate. The apparatus for estimating a depth of a buried defect in a substrate includes a light source providing a source of light, an aperture through which only a part of the source of light passes, a reflecting mirror receiving and reflecting the source of light that has passed through the aperture as a first light, a lens receiving and condensing the first light, the substrate receiving and reflecting the condensed first light as a second light, a light sensor receiving the second light and sensing a brightness of the second light, and a position adjustment portion adjusting a distance between the lens and the substrate.

Abstract translation: 提供了一种用于估计衬底中的埋入缺陷的深度的装置和方法。 用于估计衬底中的埋入缺陷的深度的装置包括提供光源的光源，光源只有一部分通过的孔，反射已经通过的光源的反射镜 通过作为第一光的光圈，接收和聚光第一光的透镜，接收并反射作为第二光的聚集的第一光的基板，接收第二光并感测第二光的亮度的光传感器，以及位置 调节部分调整透镜和基板之间的距离。