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公开(公告)号：US20220181311A1
公开(公告)日：2022-06-09
申请号：US17677182
申请日：2022-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung KWAG , Byungchul KIM , Eunhye KIM , Sangmoo PARK , Minsub OH , Dongyeob LEE , Yoonsuk LEE
Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.
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公开(公告)号：US20220116831A1
公开(公告)日：2022-04-14
申请号：US17452718
申请日：2021-10-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chihyun CHO , Heejung KIM , Dongyeob LEE , Junho LEE
Abstract: Provided is a method, performed by a source edge data network, of providing a service in a wireless communication system includes identifying a target edge data network and a handover terminal handed over to the target edge data network among a plurality of terminals provided with the service from the source edge data network; transmitting information about the identified target edge data network to a server; synchronizing status information of an application for providing the service with the target edge data network; and synchronizing user information for each of the plurality of terminals with the target edge data network.
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公开(公告)号：US20210358896A1
公开(公告)日：2021-11-18
申请号：US17244471
申请日：2021-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsuk LEE , Eunhye KIM , Sangmoo PARK , Dongyeob LEE
Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.
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公开(公告)号：US20210050498A1
公开(公告)日：2021-02-18
申请号：US16926161
申请日：2020-07-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsuk LEE , Eunhye KIM , Dongyeob LEE , Sangmoo PARK
IPC: H01L33/62 , H01L25/075 , H01L23/00
Abstract: A light emitting diode (LED) element is provided. The LED element includes: an active layer configured to generate light; a first semiconductor layer disposed on a first surface of the active layer and doped with an n-type dopant; a second semiconductor layer disposed on a second surface of the active layer opposite to the first surface, the second semiconductor layer being doped with a p-type dopant; a first electrode pad and a second electrode pad electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, the first electrode pad comprising a first contact surface and the second electrode pad comprising a second contact surface; and a conductive filler disposed on at least one contact surface from among the first contact surface and the second contact surface to increase a contact area of the at least one contact surface.
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Patent Agency Ranking
公开(公告)号：US20200343297A1
公开(公告)日：2020-10-29
申请号：US16861728
申请日：2020-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byungchul KIM , Doyoung KWAG , Eunhye Kim , Sangmoo PARK , Minsub OH , Dongyeob LEE , Yoonsuk LEE
Abstract: A micro light emitting diode (LED) transferring method includes setting a micro LED transfer substrate and a target substrate to initial positions and transferring a plurality of micro LEDs arranged in a partial region of the micro LED transfer substrate to the target substrate. Once the micro LEDs in the partial region are transferred to the target substrate, the micro LED transfer substrate is rotated and a plurality of micro LEDs, arranged in a remaining region of the micro LED transfer substrate, are then transferred to the target substrate.
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公开(公告)号：US20200313035A1
公开(公告)日：2020-10-01
申请号：US16832884
申请日：2020-03-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsuk LEE , Sangmoo PARK , Doyoung KWAG , Byungchul KIM , Eunhye KIM , Minsub OH , Dongyeob LEE
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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公开(公告)号：US20250096177A1
公开(公告)日：2025-03-20
申请号：US18962923
申请日：2024-11-27
Applicant: SAMSUNG ELECTRONICS CO, LTD
Inventor： Yoonsuk LEE , Eunhye KIM , Dongyeob LEE , Sangmoo PARK
IPC: H01L23/00 , H01L25/075 , H01L25/16 , H01L33/62
Abstract: A display module includes: a plurality of light emitting diodes; a substrate having a plurality of indium-tin oxide (ITO) electrodes disposed thereon, the plurality of ITO electrodes being connected to electrodes of the plurality of light emitting diodes; and an assembly configured to connect the electrodes of the plurality of light emitting diodes and the plurality of ITO, wherein the assembly comprises a silver (Ag) paste to be applied on the plurality of ITO electrodes, and the electrodes of the plurality of light emitting diodes and the plurality of ITO electrodes of the substrate may be bonded by eutectic bonding through the assembly during thermal compression bonding.
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公开(公告)号：US20200312822A1
公开(公告)日：2020-10-01
申请号：US16808558
申请日：2020-03-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunhye KIM , Doyoung KWAG , Byungchul KIM , Sangmoo PARK , Minsub OH , Dongyeob LEE , Yoonsuk LEE
IPC: H01L25/075 , H01L33/62
Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.
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公开(公告)号：US20200219862A1
公开(公告)日：2020-07-09
申请号：US16736057
申请日：2020-01-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seungryong HAN , Byungchul KIM , Dongyeob LEE
IPC: H01L25/16
Abstract: Provided is a method of manufacturing display apparatus including processing side surfaces of a plurality of display modules, each of the plurality of display modules including a plurality of micro light emitting diodes (LEDs) provided in pixels on an upper surface of each of the plurality of display modules, and providing the plurality of processed display modules such that the pixels of the plurality of processed display modules are provided at a same interval, respectively, wherein each of the plurality of display modules has a rectangular shape, and wherein the processing the side surfaces of the plurality of display modules includes processing a first side surface of each of the plurality of display modules and a second side surface of each of the plurality of display modules that are adjacent to the first side surface.
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