公开(公告)号：US20240412984A1

公开(公告)日：2024-12-12

申请号：US18810623

申请日：2024-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ansook Sul ,  Sungyong Park ,  Sejin Park ,  Donok Choi

IPC: H01L21/67 ,  B08B3/12 ,  B08B7/00 ,  H01L21/02 ,  H01L21/687

Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.

公开(公告)号：US12119240B2

公开(公告)日：2024-10-15

申请号：US18081948

申请日：2022-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ansook Sul ,  Sungyong Park ,  Sejin Park ,  Donok Choi

IPC: H01L21/00 ,  B08B3/12 ,  B08B7/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67034 ,  B08B3/12 ,  B08B7/0021 ,  H01L21/02101 ,  H01L21/68785

Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.

公开(公告)号：US20230187231A1

公开(公告)日：2023-06-15

申请号：US18081948

申请日：2022-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ansook Sul ,  Sungyong Park ,  Sejin Park ,  Donok Choi

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/12 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67034 ,  B08B7/0021 ,  B08B3/12 ,  H01L21/02101 ,  H01L21/68785

Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.