公开(公告)号：US11362053B2

公开(公告)日：2022-06-14

申请号：US16922828

申请日：2020-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunyoung Jeong ,  Juik Lee ,  Junghoon Han

IPC: H01L23/00

Abstract: Disclosed embodiments include a semiconductor chip including a semiconductor substrate having a top surface with a top connection pad disposed therein, and a protection insulation layer comprising an opening therein, the protection insulation layer not covering at least a portion of the top connection pad, on the semiconductor substrate. The protection insulation layer may include: a bottom protection insulation layer, a cover insulation layer comprising a side cover part that covers at least a portion of a side surface of the bottom protection insulation layer and a top cover part disposed apart from the side cover part to cover at least a portion of a top surface of the bottom protection insulation layer. The protection insulation layer may further include a top protection insulation layer on the top cover part.

公开(公告)号：US11769742B2

公开(公告)日：2023-09-26

申请号：US17747190

申请日：2022-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunyoung Jeong ,  Juik Lee ,  Junghoon Han

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L2224/05583

Abstract: Disclosed embodiments include a semiconductor chip including a semiconductor substrate having a top surface with a top connection pad disposed therein, and a protection insulation layer comprising an opening therein, the protection insulation layer not covering at least a portion of the top connection pad, on the semiconductor substrate. The protection insulation layer may include: a bottom protection insulation layer, a cover insulation layer comprising a side cover part that covers at least a portion of a side surface of the bottom protection insulation layer and a top cover part disposed apart from the side cover part to cover at least a portion of a top surface of the bottom protection insulation layer. The protection insulation layer may further include a top protection insulation layer on the top cover part.

公开(公告)号：US20210134745A1

公开(公告)日：2021-05-06

申请号：US16922828

申请日：2020-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunyoung Jeong ,  Juik Lee ,  Junghoon Han

IPC: H01L23/00

Abstract: Disclosed embodiments include a semiconductor chip including a semiconductor substrate having a top surface with a top connection pad disposed therein, and a protection insulation layer comprising an opening therein, the protection insulation layer not covering at least a portion of the top connection pad, on the semiconductor substrate. The protection insulation layer may include: a bottom protection insulation layer, a cover insulation layer comprising a side cover part that covers at least a portion of a side surface of the bottom protection insulation layer and a top cover part disposed apart from the side cover part to cover at least a portion of a top surface of the bottom protection insulation layer. The protection insulation layer may further include a top protection insulation layer on the top cover part.

公开(公告)号：US20220278061A1

公开(公告)日：2022-09-01

申请号：US17747190

申请日：2022-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunyoung Jeong ,  Juik Lee ,  Junghoon Han

IPC: H01L23/00

Abstract: Disclosed embodiments include a semiconductor chip including a semiconductor substrate having a top surface with a top connection pad disposed therein, and a protection insulation layer comprising an opening therein, the protection insulation layer not covering at least a portion of the top connection pad, on the semiconductor substrate. The protection insulation layer may include: a bottom protection insulation layer, a cover insulation layer comprising a side cover part that covers at least a portion of a side surface of the bottom protection insulation layer and a top cover part disposed apart from the side cover part to cover at least a portion of a top surface of the bottom protection insulation layer. The protection insulation layer may further include a top protection insulation layer on the top cover part.