公开(公告)号：US20190176291A1

公开(公告)日：2019-06-13

申请号：US16022166

申请日：2018-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jieun YANG ,  Dong-il YOON ,  Taemin EARMME ,  Gui Hyun CHO ,  Seok HEO ,  Jong Hwi SEO ,  Yong Won CHOI

IPC: B24B37/34 ,  B24B37/005 ,  H01L21/687

Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.