公开(公告)号：US20180076060A1

公开(公告)日：2018-03-15

申请号：US15474276

申请日：2017-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoung Whan OH ,  Yeon Woo CHOI ,  Won Yup KO ,  Min Seok MOON ,  Won Ki PARK ,  Seung Hwan LEE ,  Yong Won CHOI

IPC: H01L21/67 ,  H01L21/687 ,  B23K26/00 ,  B23K26/38

CPC classification number: H01L21/67115 ,  B23K26/032 ,  B23K26/048 ,  B23K26/0853 ,  B23K26/0861 ,  B23K26/0869 ,  B23K26/0884 ,  B23K26/38 ,  B23K26/53 ,  B23K26/702 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/68757

Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.

公开(公告)号：US20170209960A1

公开(公告)日：2017-07-27

申请号：US15281578

申请日：2016-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Whan OH ,  Yeon Woo CHOI ,  In Hwan KIM ,  Won Ki PARK ,  Ho Youl LEE ,  Yong Won CHOI

IPC: B23K26/08 ,  B23K26/402 ,  B23K26/03 ,  B23K26/38 ,  H01L21/67 ,  H01L21/78

CPC classification number: B23K26/0876 ,  B23K26/03 ,  B23K26/032 ,  B23K26/38 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/78

Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.

公开(公告)号：US20190088515A1

公开(公告)日：2019-03-21

申请号：US15950303

申请日：2018-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Won JEONG ,  Yi JIN ,  Chang Gi MIN ,  Jin Woo LEE ,  Seok HEO ,  Yong Won CHOI ,  Yun Jong CHOI

IPC: H01L21/67 ,  G05B19/418

Abstract: A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when pressure conditions change by a number of fans. The fans are then classified into different groups and subgroups and control sequences of the subgroups are determined based on the change amounts. Difference values are then calculated, and a control signal is generated to adjust the rotation speed of the fans.

公开(公告)号：US20190176291A1

公开(公告)日：2019-06-13

申请号：US16022166

申请日：2018-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jieun YANG ,  Dong-il YOON ,  Taemin EARMME ,  Gui Hyun CHO ,  Seok HEO ,  Jong Hwi SEO ,  Yong Won CHOI

IPC: B24B37/34 ,  B24B37/005 ,  H01L21/687

Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.