-
公开(公告)号:US20240387597A1
公开(公告)日:2024-11-21
申请号:US18390713
申请日:2023-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gwideok Ryan LEE , Jeongsoon KANG , Gyunha PARK , Jongeun PARK , Dongseok CHO
IPC: H01L27/146 , H04N25/63
Abstract: An image sensor includes a first structure and a second structure, each having at least one pixel and sequentially stacked in a vertical direction. Each of the pixels may include a photodiode portion, provided in the first structure, and a pixel circuit portion connected to the photodiode portion provided in the first structure.
-
公开(公告)号:US20240250104A1
公开(公告)日:2024-07-25
申请号:US18416388
申请日:2024-01-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gyunha PARK , Jeongsoon KANG , Jongeun PARK , Gwideok Ryan LEE , Dongseok CHO
IPC: H01L27/146 , H01L23/00 , H04N25/79
CPC classification number: H01L27/14634 , H01L24/08 , H01L24/80 , H01L27/1469 , H01L2224/08145 , H01L2224/80895 , H01L2224/80896 , H04N25/79
Abstract: Provided is an image sensor including a first structure and a second structure stacked in a vertical direction, wherein the first structure includes a first pixel region, a photoelectric conversion unit in the first pixel region, a floating diffusion region in the first pixel region, a first interlayer insulating layer on the floating diffusion region, and a first pixel pad electrically connected to the floating diffusion region, and the second structure includes a second pixel region, a source-follower transistor in the second pixel region, a second interlayer insulating layer on the source-follower transistor, and a second pixel pad electrically connected to a gate of the source-follower transistor, and the image sensor includes a coupling prevention line arranged around the first and second pixel pads and electrically connected to the source region of the source-follower transistor.
-
公开(公告)号:US20250072142A1
公开(公告)日:2025-02-27
申请号:US18677417
申请日:2024-05-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gyunha PARK , JONGHYUN GO , JI-YOUN SONG , KEUN YEONG CHO
IPC: H01L27/146
Abstract: An image sensor may include: a pixel array in which a plurality of pixels are arranged in a matrix, including a first pixel and a second pixel disposed adjacent to each other, each of the plurality of pixels includes: at least one photoelectric conversion device; at least one floating diffusion region to which charges of the at least one photoelectric conversion device are configured to be transferred; a reset transistor configured to transfer a voltage at a reset node to the at least one floating diffusion region; a source follower transistor having one end connected to a pixel voltage node and configured to output a sampling voltage corresponding to charges of the at least one floating diffusion region; and a select transistor having one end connected to the source follower transistor and configured to output the sampling voltage to an output node.
-
-