-
公开(公告)号:US20240387597A1
公开(公告)日:2024-11-21
申请号:US18390713
申请日:2023-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gwideok Ryan LEE , Jeongsoon KANG , Gyunha PARK , Jongeun PARK , Dongseok CHO
IPC: H01L27/146 , H04N25/63
Abstract: An image sensor includes a first structure and a second structure, each having at least one pixel and sequentially stacked in a vertical direction. Each of the pixels may include a photodiode portion, provided in the first structure, and a pixel circuit portion connected to the photodiode portion provided in the first structure.
-
公开(公告)号:US20240250104A1
公开(公告)日:2024-07-25
申请号:US18416388
申请日:2024-01-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gyunha PARK , Jeongsoon KANG , Jongeun PARK , Gwideok Ryan LEE , Dongseok CHO
IPC: H01L27/146 , H01L23/00 , H04N25/79
CPC classification number: H01L27/14634 , H01L24/08 , H01L24/80 , H01L27/1469 , H01L2224/08145 , H01L2224/80895 , H01L2224/80896 , H04N25/79
Abstract: Provided is an image sensor including a first structure and a second structure stacked in a vertical direction, wherein the first structure includes a first pixel region, a photoelectric conversion unit in the first pixel region, a floating diffusion region in the first pixel region, a first interlayer insulating layer on the floating diffusion region, and a first pixel pad electrically connected to the floating diffusion region, and the second structure includes a second pixel region, a source-follower transistor in the second pixel region, a second interlayer insulating layer on the source-follower transistor, and a second pixel pad electrically connected to a gate of the source-follower transistor, and the image sensor includes a coupling prevention line arranged around the first and second pixel pads and electrically connected to the source region of the source-follower transistor.
-
公开(公告)号:US20230092590A1
公开(公告)日:2023-03-23
申请号:US17834318
申请日:2022-06-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Haeyong PARK , Sungsoo CHOI , Jongeun PARK
IPC: H01L27/146
Abstract: An image sensor includes a substrate having first and second surfaces opposite each other, including first and second pixels adjacent to each other, a device isolation portion isolating the first and second pixels from each other in the substrate, a transfer gate on the first surface of the first and second pixels, a ground region in one of the first and second pixels, and a first color filter and a micro lens array layer stacked on the second surface. The deep device isolation portion includes first and second isolation portions vertically overlapping and spaced apart. The first isolation portion includes a first conductive pattern extending from the first surface toward the second surface, a high-concentration doped pattern on the first conductive pattern, and an insulating pattern between the first conductive pattern and the high-concentration doped pattern. The ground region and high-concentration doped pattern include dopants having the same conductivity type.
-
公开(公告)号:US20130307040A1
公开(公告)日:2013-11-21
申请号:US13785056
申请日:2013-03-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungchak AHN , Kyungho LEE , Heegeun JEONG , Sangjun CHOI , Jongeun PARK
IPC: H01L27/146
CPC classification number: H01L27/1463 , H01L27/14621 , H01L27/14627 , H01L27/14638 , H01L27/14641 , H01L27/14643
Abstract: Provided are image sensors and methods of fabricating the same. The image sensor has a transfer gate, which may be configured to include a buried portion having a flat bottom surface and a rounded lower corner. This structure of the buried portion enables to transfer electric charges stored in the photoelectric conversion part effectively.
Abstract translation: 提供图像传感器及其制造方法。 图像传感器具有传输门,其可以被配置为包括具有平坦底表面和圆形下角的掩埋部分。 埋入部分的这种结构能够有效地转移存储在光电转换部分中的电荷。
-
-
-