公开(公告)号：US20170083049A1

公开(公告)日：2017-03-23

申请号：US15273018

申请日：2016-09-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hae-Soo KIM ,  Dong-Yun LEE ,  Woo-Jung SHIM

IPC: G06F1/16

CPC classification number: G06F1/1626 ,  G06F1/1632 ,  G06F1/1654 ,  G06F1/1656 ,  G06F1/1679

Abstract: An electronic device is provided, which uses magnetic force to couple to an external device. The electronic device includes a housing, a magnet positioned within the housing, and an elastic body connected to the magnet. At least a portion of the elastic body changes a shape or a position thereof, in response to a change of a magnetic force of the magnet.

公开(公告)号：US20160302320A1

公开(公告)日：2016-10-13

申请号：US15044615

申请日：2016-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-Sung KIM ,  Hae-Soo KIM ,  Cha-Hoon PARK ,  Kang-Seok CHO ,  Sung-Geun JOO ,  Sung-Hun KIM ,  Kwang-Yong LEE ,  Sung-Yun JIN

IPC: H05K7/02 ,  G06F1/16 ,  G06F1/18

CPC classification number: G06F1/1698 ,  G06F1/181 ,  G06F1/183 ,  G06F2200/1635

Abstract: An electronic device is provided. The electronic device includes a main unit including a first top surface, a first bottom surface opposite to the first top surface, and a first side surface configured to connect the first top surface and the first bottom surface, and at least one module unit including a second top surface, a second bottom surface opposite to the second top surface, and a second side surface configured to connect the second top surface and the second bottom surface. The module unit may be configured to couple to and uncouple from the main unit or another module unit in a state where one of the second top surface, the second bottom surface, and the second side surface faces one of the first top surface, the first bottom surface, and the first side surface. When the module unit is coupled to the main unit, the module unit may be electrically connected with the main unit.

Abstract translation: 提供电子设备。 电子设备包括主单元，其包括第一顶表面，与第一顶表面相对的第一底表面和被配置为连接第一顶表面和第一底表面的第一侧表面，以及至少一个模块单元， 第二顶表面，与第二顶表面相对的第二底表面，以及构造成连接第二顶表面和第二底表面的第二侧表面。 模块单元可以被配置为在第一顶表面，第二底表面和第二侧表面之一面对第一顶表面之一，第一第一顶表面 底表面和第一侧表面。 当模块单元耦合到主单元时，模块单元可以与主单元电连接。

公开(公告)号：US20150323262A1

公开(公告)日：2015-11-12

申请号：US14667035

申请日：2015-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hae-Soo KIM

IPC: F28D15/02 ,  H05K7/20

CPC classification number: G06F1/203 ,  F28D15/0233 ,  F28D15/046 ,  F28F21/02 ,  F28F21/081 ,  F28F21/083 ,  F28F21/084 ,  F28F21/085 ,  F28F21/089 ,  F28F2265/10 ,  H01L23/427 ,  H05K7/20336

Abstract: A heat dissipating apparatus and an electronic device having the same are provided. The electronic device includes a body, an internal circuit board provided in the body and including at least one heat generating element, and a heat diffusion type heat dissipating module provided in the body and stacked on a surface of the internal circuit board, so as to diffuse heat generated by the heat generating element toward a low temperature region having a temperature lower than a temperature of the at least one heat generating unit. The heat diffusion type heat dissipating module has a sheet shape which extends from the heat generating element toward a circumference surface of an inside of the body so that the heat is transferred from the heat generating element to the low temperature region.

Abstract translation: 提供了一种散热装置和具有该散热装置的电子装置。 电子设备包括主体，设置在主体中的内部电路板，并且包括至少一个发热元件，以及散热型散热模块，其设置在主体中，堆叠在内部电路板的表面上，以便 由发热元件向具有低于至少一个发热单元的温度的低温区域产生的散热。 热扩散型散热模块具有从发热元件朝向主体内侧的周面延伸的片状，使得热量从发热元件传递到低温区域。