公开(公告)号：US20160302320A1

公开(公告)日：2016-10-13

申请号：US15044615

申请日：2016-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-Sung KIM ,  Hae-Soo KIM ,  Cha-Hoon PARK ,  Kang-Seok CHO ,  Sung-Geun JOO ,  Sung-Hun KIM ,  Kwang-Yong LEE ,  Sung-Yun JIN

IPC: H05K7/02 ,  G06F1/16 ,  G06F1/18

CPC classification number: G06F1/1698 ,  G06F1/181 ,  G06F1/183 ,  G06F2200/1635

Abstract: An electronic device is provided. The electronic device includes a main unit including a first top surface, a first bottom surface opposite to the first top surface, and a first side surface configured to connect the first top surface and the first bottom surface, and at least one module unit including a second top surface, a second bottom surface opposite to the second top surface, and a second side surface configured to connect the second top surface and the second bottom surface. The module unit may be configured to couple to and uncouple from the main unit or another module unit in a state where one of the second top surface, the second bottom surface, and the second side surface faces one of the first top surface, the first bottom surface, and the first side surface. When the module unit is coupled to the main unit, the module unit may be electrically connected with the main unit.

Abstract translation: 提供电子设备。 电子设备包括主单元，其包括第一顶表面，与第一顶表面相对的第一底表面和被配置为连接第一顶表面和第一底表面的第一侧表面，以及至少一个模块单元， 第二顶表面，与第二顶表面相对的第二底表面，以及构造成连接第二顶表面和第二底表面的第二侧表面。 模块单元可以被配置为在第一顶表面，第二底表面和第二侧表面之一面对第一顶表面之一，第一第一顶表面 底表面和第一侧表面。 当模块单元耦合到主单元时，模块单元可以与主单元电连接。