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公开(公告)号：US20220166867A1
公开(公告)日：2022-05-26
申请号：US17430222
申请日：2020-02-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hojung NAM , Junwoo KIM , Chankyu AN , Sungkoo PARK , Cheolhong SON , Soonho HWANG
Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate, and a side member, a metal structure of which a part is connected to the side member, and a printed circuit board. The side member includes a first conductive portion, a second conductive portion, a third conductive portion, a first segment formed between the first conductive portion and the second conductive portion, and a second segment formed between the first conductive portion and the third conductive portion. The first conductive portion is connected to a first ground part disposed on the printed circuit board through a first path, and is connected to a second ground part disposed on the metal structure through a second path spaced from the first path by a specific distance.
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2.发明申请公开(公告)号：US20200350669A1
公开(公告)日：2020-11-05
申请号：US16964680
申请日：2018-12-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Mincheol SEO , Dongyeon KIM , Hojung NAM , Jeongwan PARK , Chankyu AN , Sungjun LEE , Nakchung CHOI , Yoonjae LEE
Abstract: According to one embodiment of the disclosure, an electronic device comprises: a printed circuit board including a conductive pattern; and a tuner mounted on the conductive pattern and electrically connected to the conductive pattern, wherein the tuner comprises: a ground; a first conductive pad; a first switching element electrically connected between the ground and the first conductive pad; and a second conductive pad electrically disconnected with the ground, wherein the conductive pattern may comprise: a first electrical path in electrical contact with the first conductive pad; and a second electrical path in electrical contact with the second conductive pad and electrically shorted to the first electrical path. Various other embodiments are possible.
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公开(公告)号：US20250070454A1
公开(公告)日：2025-02-27
申请号：US18821411
申请日：2024-08-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hojung NAM , Sungkoo PARK , Kyungmoon SEOL , Cheolhong SON , Kookjoo LEE , Donguk CHOI , Jaewon CHOE , Soonho HWANG
Abstract: An electronic device according to an embodiments includes a foldable housing including a first housing part, a second housing part and a third housing part, a wireless communication circuit, a first conductive portion formed along at least a portion of a first side exterior surface of the first housing part and including a feeding point and a ground point, and a filter circuit electrically connected to a portion of a second conductive portion in a second side exterior surface of the second housing part. The portion corresponds to a region between the feeding point of the first conductive portion and the ground point of the first conductive portion, in a folded state in which the first housing part and the second housing part are folded.
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Patent Agency Ranking
公开(公告)号：US20240380103A1
公开(公告)日：2024-11-14
申请号：US18781686
申请日：2024-07-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hojung NAM , Kyoungmok KIM , Jaeho LIM , Myeongjun KONG , Soonho HWANG
Abstract: An electronic device according to an embodiment comprises: a printed circuit board; a first electronic component electrically connected to the printed circuit board; a second electronic component electrically connected to the printed circuit board and facing one side surface of the first electronic component; a first conductive plate including a feeding point supporting the first electronic component and electrically connected to the printed circuit board; a second conductive plate spaced apart from the first conductive plate and supporting the second electronic component; and a plurality of bridges connecting the first conductive plate with the second conductive plate to form a slot, wherein a wireless communication circuit may be configured to communicate with an external electronic device through at least one frequency band using the first conductive plate and the second conductive plate.
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公开(公告)号：US20250149776A1
公开(公告)日：2025-05-08
申请号：US18977272
申请日：2024-12-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungkoo PARK , Seunghwan KIM , Haeyeon KIM , Hojung NAM , Kyungjae LEE , Kookjoo LEE , Jaebong CHUN , Soonho HWANG
Abstract: An electronic device is provided. The electronic device includes a hinge module, a first housing having at least a portion coupled to a first side of the hinge module, a printed circuit board which is disposed inside the first housing and includes a wireless communication module, a processor, and a ground, and a second housing having at least a portion coupled to a second side of the hinge module and configured to be unfoldable and foldable with respect to the first housing using the hinge module, wherein the first housing includes a first conductive portion, a second conductive portion, and a third conductive portion which are electrically connected to the wireless communication module, a first non-conductive portion disposed between the first conductive portion and the third conductive portion, and a second non-conductive portion disposed between the second conductive portion and the third conductive portion, wherein the third conductive portion is configured to be electrically connected to a first matching circuit through a first point, wherein the first matching circuit is configured to be electrically connected to the processor through a first electrical path, wherein the processor is configured to control an impedance of the first matching circuit to correspond to a first impedance while the first conductive portion operates to radiate signals in a first frequency band and the second conductive portion operates to radiate signals in the first frequency band, and wherein the processor is further configured to control an impedance of the first matching circuit to correspond to a second impedance while the first conductive portion operates to radiate signals in a second frequency band and the second conductive portion operates to radiate signals in the second frequency band.
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公开(公告)号：US20250125538A1
公开(公告)日：2025-04-17
申请号：US18986127
申请日：2024-12-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaehoon JO , Hojung NAM , Sungkoo PARK , Kyungjae LEE , Kookjoo LEE , Soonho HWANG
Abstract: A foldable electronic device includes a first housing including a first rear cover and a first bracket, a second housing including a second rear cover and a second bracket, a hinge module rotatably interconnecting the first housing and the second housing, a hinge cover coupled to the hinge module, and a wireless communication circuit. A first slot is formed in a conductive area of the first bracket. In a direction orthogonal to the first rear cover, at least a portion of the first slot overlaps the hinge cover in an unfolded state of the foldable electronic device. The wireless communication circuit is configured to transmit, receive, or transmit and receive a signal of a predetermined frequency band through the first slot formed in the conductive area of the first bracket.
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公开(公告)号：US20240291914A1
公开(公告)日：2024-08-29
申请号：US18658335
申请日：2024-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hojung NAM , Junwoo KIM , Chankyu AN , Sungkoo PARK , Cheolhong SON , Soonho HWANG
CPC classification number: H04M1/0277 , H01Q1/242 , H05K1/0237 , H05K7/1427
Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate, and a side member, a metal structure of which a part is connected to the side member, and a printed circuit board. The side member includes a first conductive portion, a second conductive portion, a third conductive portion, a first segment formed between the first conductive portion and the second conductive portion, and a second segment formed between the first conductive portion and the third conductive portion. The first conductive portion is connected to a first ground part disposed on the printed circuit board through a first path, and is connected to a second ground part disposed on the metal structure through a second path spaced from the first path by a specific distance.
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公开(公告)号：US20240040020A1
公开(公告)日：2024-02-01
申请号：US18483995
申请日：2023-10-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Soonho HWANG , Himchan YUN , Kookjoo LEE , Hojung NAM , Sungkoo PARK , Kyungjae LEE , Donguk CHOI , Seunghwan KIM , Jaebong CHUN
CPC classification number: H04M1/0214 , H01Q1/243 , H04M1/0268
Abstract: A foldable electronic device is provided that includes a hinge module, a first housing coupled to a first side of the hinge module, a first printed circuit board disposed inside the first housing and including a first wireless communication module, a processor, and a first ground or a second ground, and a second housing coupled to a second side of the hinge module, in which the first housing includes a first segmenting portion, a second segmenting portion, a first conductive portion, and a second conductive portion, in which the second housing includes a second wireless communication module, a third segmenting portion, a fourth segmenting portion, a third conductive portion, and a fourth conductive portion, and in which a matching circuit is disposed between the first conductive portion and the first ground, and a first filter circuit is connected to a signal path between the first conductive portion and the matching circuit.
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