公开(公告)号：US20250062213A1

公开(公告)日：2025-02-20

申请号：US18731988

申请日：2024-06-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyuho Kang ,  Hyungjun Park ,  Kwangok Jeong ,  Juil Choi ,  Taeoh Ha ,  Hongseo Heo

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor package includes a lower redistribution wiring layer that includes first redistribution wirings, a protective layer that defines openings, and bonding pads that are on the protective layer and are electrically connected to the first redistribution wirings through the openings; conductive bumps that are on first bonding pads of the bonding pads; and a semiconductor chip on the first bonding pads, where each of the bonding pads includes: a conductive pillar in a respective opening of the openings of the protective layer, where the conductive pillar includes a first diameter; and a pad pattern that is on the protective layer and an upper surface of the conductive pillar, where the pad pattern includes a second diameter that is greater than the first diameter.