公开(公告)号：US20250062213A1

公开(公告)日：2025-02-20

申请号：US18731988

申请日：2024-06-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyuho Kang ,  Hyungjun Park ,  Kwangok Jeong ,  Juil Choi ,  Taeoh Ha ,  Hongseo Heo

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor package includes a lower redistribution wiring layer that includes first redistribution wirings, a protective layer that defines openings, and bonding pads that are on the protective layer and are electrically connected to the first redistribution wirings through the openings; conductive bumps that are on first bonding pads of the bonding pads; and a semiconductor chip on the first bonding pads, where each of the bonding pads includes: a conductive pillar in a respective opening of the openings of the protective layer, where the conductive pillar includes a first diameter; and a pad pattern that is on the protective layer and an upper surface of the conductive pillar, where the pad pattern includes a second diameter that is greater than the first diameter.

公开(公告)号：US20240387463A1

公开(公告)日：2024-11-21

申请号：US18614964

申请日：2024-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeonggi Jin ,  Gyuho Kang ,  Unbyoung Kang ,  Taehee Kim ,  Hyungjun Park

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/10 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10

Abstract: A semiconductor package includes a semiconductor device including a substrate, bonding pads provided on a front surface of the substrate and bump structures provided on the bonding pads respectively, each of the bump structures having a metal pillar and a metal paste coated on one end portion of the metal pillar; and a wiring layer including a metal wiring layer having redistribution pads and a protective layer on the metal wiring layer and having recesses that expose at least portions of the redistribution pads. The semiconductor device is stacked on the wiring layer via the bump structures. Portions of the bump structures are respectively disposed in the recesses of the protective layer, and the metal pastes are respectively bonded to the redistribution pads.

公开(公告)号：US20230361046A1

公开(公告)日：2023-11-09

申请号：US18095642

申请日：2023-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juil Choi ,  Jusuk Kang ,  Hyungjun Park ,  Sanghyuck Oh ,  Hyunju Lee ,  Sangyeol Choi

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/31 ,  H10B80/00

CPC classification number: H01L23/5383 ,  H01L23/49811 ,  H01L23/3128 ,  H01L23/49816 ,  H10B80/00

Abstract: Provided are a semiconductor package having a structure maximizing heat dissipation efficiency and a method of manufacturing the same. The semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a plurality of through posts on the first redistribution substrate, around the first semiconductor chip, and a second redistribution substrate located over the first semiconductor chip and the through posts, wherein a top surface of the first semiconductor chip is in contact with a bottom surface of the second redistribution substrate.