ELECTRONIC DEVICE WITH BONDING STRUCTURE
    2.
    发明申请

    公开(公告)号:US20200183455A1

    公开(公告)日:2020-06-11

    申请号:US16706006

    申请日:2019-12-06

    IPC分类号: G06F1/16

    摘要: An electronic device is provided that includes a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the front plate and the rear plate and at least partially constructed of a metal material, wherein the front plate includes a first edge having a first length and extending in a third direction, a second edge having a second length longer than the first length and extending in a fourth direction orthogonal to the third direction, a third edge parallel to the first edge, having the first length, and extending in the third direction from the second edge, a fourth edge parallel to the second edge, having the second length, and extending in the fourth direction from the first edge, a first region in which the third edge and the fourth edge meet, and a second region in which the second edge and the third edge meet, a display viewable through the front plate, and an adhesive layer constructed in a closed-curve shape along the first edge, second edge, third edge, and fourth edge of the front plate, wherein, when viewed from above the display, a width of the adhesive layer in the first region and the second region is greater than a width of the adhesive layer outside the first region and the second region.

    ELECTRONIC DEVICE INCLUDING ACTUATOR FOR REMOVING TRAY

    公开(公告)号:US20240040022A1

    公开(公告)日:2024-02-01

    申请号:US18229005

    申请日:2023-08-01

    IPC分类号: H04M1/02

    CPC分类号: H04M1/026

    摘要: An electronic device includes: a housing including an opening and sockets; a tray to be insertable into the sockets or removable from the sockets through the opening; and an actuator to generate power to remove the tray from the sockets. The tray includes: a tray body including a space for inserting an external component into the sockets in a longitudinal direction; a tray head provided at one end of the tray body in the longitudinal direction; and a protrusion provided at another end of the tray body in the longitudinal direction and including an inclined surface provided on one side of the protrusion. When the tray is inserted into the sockets, the actuator presses the inclined surface in a width direction of the tray and removes the tray from the sockets in the longitudinal direction of the tray.

    ELECTRONIC DEVICE HAVING PARTIAL LEDGER IN BLOCKCHAIN NETWORK AND OPERATING METHOD THEREOF

    公开(公告)号:US20230261887A1

    公开(公告)日:2023-08-17

    申请号:US18139551

    申请日:2023-04-26

    IPC分类号: H04L9/00 H04L9/08

    摘要: An electronic device constituting a first blockchain node included in a blockchain network may generate an encryption key corresponding to a transaction based on obtaining a transaction generation request, transmit information of the encryption key to at least one blockchain node related to the transaction, encrypt first data stored in the partial ledger among input data required to execute a first smart contract of the transaction based on the encryption key, upload the first data to a data server included in the blockchain network, download second data encrypted based on the encryption key from the data server, the second data being data not stored in the partial ledger among the input data, decrypt the second data based on the encryption key, and execute the first smart contract based on the first data and the decrypted second data.

    SEMICONDUCTOR DEVICE
    5.
    发明申请

    公开(公告)号:US20210104615A1

    公开(公告)日:2021-04-08

    申请号:US16893795

    申请日:2020-06-05

    IPC分类号: H01L29/49 H01L23/532 G11C5/02

    摘要: A semiconductor device includes a peripheral circuit region comprising a first substrate, circuit elements on the first substrate, a first insulating layer covering the circuit elements, and a contact plug passing through the first insulating layer and disposed to be connected to the first substrate; and a memory cell region comprising a second substrate, gate electrodes on the second substrate and stacked in a vertical direction, and channel structures passing through the gate electrodes, wherein the contact plug comprises a metal silicide layer disposed to contact the first substrate and having a first thickness, a first metal nitride layer on the metal silicide layer to contact the metal silicide layer and having a second thickness, greater than the first thickness, a second metal nitride layer on the first metal nitride layer, and a conductive layer on the second metal nitride layer.

    ELECTRONIC DEVICE WITH BONDING STRUCTURE

    公开(公告)号:US20210089085A1

    公开(公告)日:2021-03-25

    申请号:US17112121

    申请日:2020-12-04

    IPC分类号: G06F1/16

    摘要: An electronic device is provided that includes a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the front plate and the rear plate and at least partially constructed of a metal material, wherein the front plate includes a first edge having a first length and extending in a third direction, a second edge having a second length longer than the first length and extending in a fourth direction orthogonal to the third direction, a third edge parallel to the first edge, having the first length, and extending in the third direction from the second edge, a fourth edge parallel to the second edge, having the second length, and extending in the fourth direction from the first edge, a first region in which the third edge and the fourth edge meet, and a second region in which the second edge and the third edge meet, a display viewable through the front plate, and an adhesive layer constructed in a closed-curve shape along the first edge, second edge, third edge, and fourth edge of the front plate, wherein, when viewed from above the display, a width of the adhesive layer in the first region and the second region is greater than a width of the adhesive layer outside the first region and the second region.