SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20190385915A1

    公开(公告)日:2019-12-19

    申请号:US16249353

    申请日:2019-01-16

    Abstract: A semiconductor device includes a substrate including at least a first region, first active patterns and a first dummy pattern which vertically protrude from the first region, a device isolation layer filling a first trench, a second trench and a third trench of the substrate, and a gate electrode intersecting the first active patterns. The first trench defines the first active patterns on the first region, the second trench defines a first sidewall of the first region, and the third trench defines a second sidewall of the first region, which is opposite to the first sidewall. A sidewall of the first dummy pattern is aligned with the second sidewall of the first region, and a level of a top of the second sidewall of the first region is higher than a level of a top of the first sidewall of the first region.

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