公开(公告)号：US20240203854A1

公开(公告)日：2024-06-20

申请号：US18228209

申请日：2023-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeon Jeong HWANG ,  Geun Woo KIM

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49827 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32146 ,  H01L2224/32235 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1058 ,  H01L2924/1433 ,  H01L2924/1435

Abstract: A semiconductor package an interposer disposed on a substrate, a recess recessed from an upper surface of the interposer, a connection structure disposed inside the recess, a first post disposed on the upper surface of the interposer and electrically connected to the interposer, a second post disposed on an upper surface of the connection structure and electrically connected to the connection structure, a first lower semiconductor chip disposed between the first and second posts and disposed on the upper surface of the interposer and the upper surface of the connection structure. The first lower semiconductor chip is electrically connected to the second post through the connection structure, and a first upper semiconductor chip is disposed on an upper surface of the first lower semiconductor chip. The first upper semiconductor chip is electrically connected to the first lower semiconductor chip through the second post and the connection structure.