公开(公告)号：US20170239525A1

公开(公告)日：2017-08-24

申请号：US15440515

申请日：2017-02-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong Yun KIM ,  Ji Young KONG ,  Sang Mi KIM ,  Geun Woo KIM ,  Seung Wok HAN

IPC: A63B24/00 ,  A63B71/06

CPC classification number: A63B24/0062 ,  A63B24/0087 ,  A63B71/0622 ,  A63B2024/0068 ,  A63B2024/0071 ,  A63B2024/0093 ,  A63B2071/0625 ,  A63B2220/12 ,  A63B2220/17 ,  A63B2220/20 ,  A63B2220/30 ,  A63B2220/34 ,  A63B2220/40 ,  A63B2220/62 ,  A63B2220/73 ,  A63B2220/74 ,  A63B2230/06 ,  A63B2230/202 ,  A63B2230/50 ,  G06F3/04842 ,  G06F3/04847 ,  G16H20/30 ,  G16H40/63

Abstract: An electronic device includes a display, a memory configured to store priorities of sensors included in at least one of the electronic device and an external electronic device connected to the electronic device through a communication circuit, the priorities being set based on a type of exercise, a processor electrically connected to the display and the memory, and a connection interface configured to electrically connect the processor with the sensors. The processor is configured to select at least one first sensor of the sensors, based on the stored priorities of the sensors when the type of the exercise is designated, to designate the first sensor as an exercise measuring sensor that measures the exercise, to obtain first sensing data, based on the exercise, through the exercise measuring sensor, to analyze the first sensing data, and to provide exercise information based on the analyzed result of the first sensing data.

公开(公告)号：US20250063763A1

公开(公告)日：2025-02-20

申请号：US18441269

申请日：2024-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won Keun CHUNG ,  Geun Woo KIM ,  Jun Ki PARK ,  Wan Don KIM ,  Hyo Seok CHOI

IPC: H01L29/417 ,  H01L21/285 ,  H01L23/528 ,  H01L29/06 ,  H01L29/40 ,  H01L29/423 ,  H01L29/45 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

Abstract: A semiconductor device may include a backside wiring line in a first backside interlayer insulating film, a fin-type pattern on the backside wiring line, a second backside interlayer insulating film between the fin-type pattern and the first backside interlayer insulating film, a gate electrode on the fin-type pattern, a first source/drain pattern on a side of the gate electrode, and a backside source/drain contact in a backside contact hole defined by the fin-type pattern and the second backside interlayer insulating film. The backside source/drain contact may connect the backside wiring line and the first source/drain pattern. The backside source/drain contact may include an upper pattern and a lower pattern. The upper pattern may be between the lower pattern and the first source/drain pattern, and may fill at least a portion of the first backside contact hole. The upper pattern may have a single conductive film structure.

公开(公告)号：US20240120279A1

公开(公告)日：2024-04-11

申请号：US18471730

申请日：2023-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong Hyuk YIM ,  Wan Don KIM ,  Hyun Bae LEE ,  Hyo Seok CHOI ,  Geun Woo KIM

IPC: H01L23/535 ,  H01L21/768 ,  H01L23/528 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/775

CPC classification number: H01L23/535 ,  H01L21/76831 ,  H01L21/76843 ,  H01L21/76895 ,  H01L23/5286 ,  H01L29/0673 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/775

Abstract: A semiconductor device may include a first film and a second film defining parts of a trench, a plug conductive film, a via, and a wiring in the trench. The trench may include a second sub-trench having a second width below a first sub-trench having a first width. The plug conductive film may extend from a first side of the first film to penetrate a bottom face of the trench. An uppermost face of the plug conducive film may be in the trench. The via may include an insulating liner between the plug conductive film and the first film. The uppermost face of the plug conductive film and at least a part of a side wall of the plug conductive film may be in contact with the wiring. An upper face of the insulating liner may be exposed by a bottom face of the second sub-trench.

公开(公告)号：US20160375306A1

公开(公告)日：2016-12-29

申请号：US15191924

申请日：2016-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heum Mo GU ,  Geun Woo KIM ,  Hyung KIM ,  Hee Seung SHIN ,  Wan Sang LEE ,  Young Woon CHUN ,  Kyung Sub MIN

IPC: A63B24/00 ,  G01C21/36 ,  G01S19/42 ,  G01C21/34

CPC classification number: A63B24/0075 ,  A63B24/0021 ,  A63B2024/0025 ,  A63B2220/12 ,  A63B2220/18 ,  A63B2220/20 ,  A63B2220/30 ,  A63B2220/62 ,  G01C21/20 ,  G01C21/32 ,  G01C21/343 ,  G01C21/3673 ,  G01C21/3676 ,  G01C22/006 ,  G01S19/42

Abstract: A method and apparatus for providing workout guide information are provided. The apparatus includes a display, a memory configured to store workout route data including location data and elevation data, and a user profile, and a processor configured to determine at least one slope section through an analysis of the workout route data based on the user profile and output a map for displaying a workout route including the slope section to the display. The slope section in the workout route is configured to be displayed in a different form than a non-slope section. In addition, various embodiments identified throughout the specification are disclosed.

Abstract translation: 提供了一种用于提供锻炼指导信息的方法和装置。 该装置包括显示器，被配置为存储包括位置数据和高程数据的锻炼路线数据的存储器和用户简档，以及处理器，其被配置为基于用户简档来通过对锻炼路线数据的分析来确定至少一个斜率部分 并且向显示器输出用于显示包括斜坡部分的锻炼路线的地图。 锻炼路线中的斜坡部分被配置为以与非斜坡部分不同的形式显示。 此外，还公开了在整个说明书中标识的各种实施例。

公开(公告)号：US20220068871A1

公开(公告)日：2022-03-03

申请号：US17227729

申请日：2021-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Geun Woo KIM

IPC: H01L23/00 ,  B23K26/03 ,  B23K26/00 ,  B23K1/005

Abstract: A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value.

公开(公告)号：US20160217348A1

公开(公告)日：2016-07-28

申请号：US15008009

申请日：2016-01-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ik Hwan CHO ,  Seung Wok HAN ,  Heum Mo GU ,  Kyung Sub MIN ,  Geun Woo KIM ,  Sang Mi KIM ,  Tae Kyung KIM ,  Jung Ki MIN ,  Seong Ook JEONG

IPC: G06K9/62 ,  G06F17/30 ,  G06T1/00

CPC classification number: G06F17/3028 ,  G06F17/30 ,  G06F17/30259 ,  G06K9/00335 ,  G06K9/00751 ,  G06K2209/27 ,  G06T1/0007

Abstract: An image processing method and an electronic device supporting the same are disclosed. An electronic device is provided to collect a plurality of images. The electronic device may collect the images by taking pictures/videos with a camera or by receiving the images from an external device. The electronic device also includes a processor able to determine an activity type during at least a portion of time when the images were taken by the camera or an activity type of the device that originally generated the images received from the external device. The processor may be able to select at least some of the collected images based on the activity type to generate a highlight content.

Abstract translation: 公开了一种图像处理方法和支持该图像处理方法的电子设备。 提供电子设备来收集多个图像。 电子设备可以通过用相机拍摄照片或视频或者从外部设备接收图像来收集图像。 电子设备还包括处理器，其能够在由照相机拍摄图像的至少一部分时间或最初生成从外部设备接收的图像的设备的活动类型时确定活动类型。 处理器可以能够基于活动类型来选择所收集的图像中的至少一些，以生成高亮度内容。

公开(公告)号：US20240203854A1

公开(公告)日：2024-06-20

申请号：US18228209

申请日：2023-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeon Jeong HWANG ,  Geun Woo KIM

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49827 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32146 ,  H01L2224/32235 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1058 ,  H01L2924/1433 ,  H01L2924/1435

Abstract: A semiconductor package an interposer disposed on a substrate, a recess recessed from an upper surface of the interposer, a connection structure disposed inside the recess, a first post disposed on the upper surface of the interposer and electrically connected to the interposer, a second post disposed on an upper surface of the connection structure and electrically connected to the connection structure, a first lower semiconductor chip disposed between the first and second posts and disposed on the upper surface of the interposer and the upper surface of the connection structure. The first lower semiconductor chip is electrically connected to the second post through the connection structure, and a first upper semiconductor chip is disposed on an upper surface of the first lower semiconductor chip. The first upper semiconductor chip is electrically connected to the first lower semiconductor chip through the second post and the connection structure.

公开(公告)号：US20240047303A1

公开(公告)日：2024-02-08

申请号：US18361099

申请日：2023-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Don MUN ,  Geun Woo KIM ,  Tae-Young LEE

IPC: H01L23/46 ,  H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/46 ,  H01L25/0655 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/552 ,  H01L24/08 ,  H01L2224/08235 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438

Abstract: A semiconductor package structure include a silicon substrate, a plurality of dies on the silicon substrate, a mold layer between the plurality of dies, a metal layer covering an upper side of the mold layer and at least a part of upper sides of each of the plurality of dies, and including an opening that exposes a part of the upper side of at least one die among the plurality of dies, and a temperature controller configured to control a temperature of the plurality of dies, the temperature controller including a body defining a circulation region configured to circulate a fluid for controlling the temperature of the plurality of dies, and a passage part configured to allow the fluid to flow into or out of the circulation region, and the fluid in the circulation region being in direct contact with exposed upper sides of the plurality of dies.