公开(公告)号：US20240304766A1

公开(公告)日：2024-09-12

申请号：US18417508

申请日：2024-01-19

申请人： Samsung Electronics Co., Ltd.

发明人： Hanhyoung Kim ,  Jaesung You ,  Hyeongdu Choi

IPC分类号： H01L33/54 ,  H01L33/62

CPC分类号： H01L33/54 ,  H01L33/62

摘要： A light-emitting device package includes a mold, a first electrode and a second electrode that are at least partially buried in the mold, a first light source disposed on the first electrode and electrically connected thereto, and a coating layer disposed on a first portion of the first electrode and a second portion of the second electrode. A thickness of the coating layer is 40 nm or more.