公开(公告)号：US11655991B2

公开(公告)日：2023-05-23

申请号：US16627250

申请日：2018-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Jin Kim ,  Seung Won Yeum ,  Hyo Ju Moon ,  Jong Hoon Park ,  Hyeong Joon Seo ,  Sung Jin In ,  Hong Seok Jun ,  Young Moo Huh ,  Kwang Il Nam ,  Sung Dai Cho

IPC: F24F11/00 ,  F24F1/0087 ,  F24F1/0007 ,  F24F110/20

CPC classification number: F24F11/0008 ,  F24F1/00075 ,  F24F1/0087 ,  F24F2110/20

Abstract: An air conditioner of the disclosure includes a compressor; an indoor heat exchanger temperature sensor configured to sense an indoor heat exchanger temperature; an indoor humidity sensor configured to sense indoor humidity; and a controller configured to calculate a dew point temperature using the humidity value detected by the indoor humidity sensor and an indoor set temperature, and control a frequency of the compressor based on the calculated dew point temperature and the indoor heat exchanger temperature.

公开(公告)号：US09528732B2

公开(公告)日：2016-12-27

申请号：US14062156

申请日：2013-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Goo Kim ,  Hyo Ju Moon ,  Jong Youb Kim ,  Jae Hyuk Oh

IPC: F25B7/00 ,  F25B39/04 ,  F25B27/00 ,  F25B30/02 ,  F25B13/00 ,  F25B25/00 ,  F24D3/18 ,  F24D17/00 ,  F24D17/02 ,  F24D19/10

CPC classification number: F25B30/02 ,  F24D3/18 ,  F24D17/001 ,  F24D17/02 ,  F24D19/1072 ,  F24D2200/31 ,  F25B7/00 ,  F25B13/00 ,  F25B25/005 ,  F25B2313/009 ,  F25B2313/02732 ,  F25B2313/02743 ,  F25B2313/0292 ,  F25B2339/047 ,  Y02B30/52

Abstract: A heat pump apparatus is provided. The heat pump raises the water temperature during a hot-water supply without using a separate heat source such as a heater. The heat pump apparatus includes an outdoor unit including a first compressor, a first heat exchanger, and a first expansion valve. The heat pump apparatus includes an indoor unit including a second heat exchanger and a second expansion valve, a hydro unit including a second compressor, a third heat exchanger, a fourth heat exchanger, a fifth heat exchanger, a third expansion valve, a fourth expansion valve, and a fifth expansion valve. The heat pump apparatus includes a refrigerant flow path switching unit to switch among flow paths, and a water flow path switching unit to switch between flow paths of the water.

Abstract translation: 提供一种热泵装置。 热泵在不使用加热器等单独的热源的情况下，提高热水供给时的水温。 该热泵装置包括具有第一压缩机，第一热交换器和第一膨胀阀的室外机。 该热泵装置包括具有第二热交换器和第二膨胀阀的室内机组，包括第二压缩机，第三热交换器，第四热交换器，第五热交换器，第三膨胀阀，第四膨胀阀 阀和第五膨胀阀。 热泵装置包括在流路之间切换的制冷剂流路切换单元和在水的流路之间切换的水流路切换单元。

公开(公告)号：US20140116072A1

公开(公告)日：2014-05-01

申请号：US14062156

申请日：2013-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Goo KIM ,  Hyo Ju Moon ,  Jong Youb Kim ,  Jae Hyuk Oh

IPC: F25B30/02

CPC classification number: F25B30/02 ,  F24D3/18 ,  F24D17/001 ,  F24D17/02 ,  F24D19/1072 ,  F24D2200/31 ,  F25B7/00 ,  F25B13/00 ,  F25B25/005 ,  F25B2313/009 ,  F25B2313/02732 ,  F25B2313/02743 ,  F25B2313/0292 ,  F25B2339/047 ,  Y02B30/52

Abstract: A heat pump apparatus is provided. The heat pump raises the water temperature during a hot-water supply without using a separate heat source such as a heater. The heat pump apparatus includes an outdoor unit including a first compressor, a first heat exchanger, and a first expansion valve. The heat pump apparatus includes an indoor unit including a second heat exchanger and a second expansion valve, a hydro unit including a second compressor, a third heat exchanger, a fourth heat exchanger, a fifth heat exchanger, a third expansion valve, a fourth expansion valve, and a fifth expansion valve. The heat pump apparatus includes a refrigerant flow path switching unit to switch among flow paths, and a water flow path switching unit to switch between flow paths of the water.

Abstract translation: 提供一种热泵装置。 热泵在不使用加热器等单独的热源的情况下，提高热水供给时的水温。 该热泵装置包括具有第一压缩机，第一热交换器和第一膨胀阀的室外机。 该热泵装置包括具有第二热交换器和第二膨胀阀的室内机组，包括第二压缩机，第三热交换器，第四热交换器，第五热交换器，第三膨胀阀，第四膨胀阀 阀和第五膨胀阀。 热泵装置包括在流路之间切换的制冷剂流路切换单元和在水的流路之间切换的水流路切换单元。