公开(公告)号：US09024403B2

公开(公告)日：2015-05-05

申请号：US13870453

申请日：2013-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Sang Park ,  Hyo Young Shin

IPC: H01L27/148 ,  G02B6/12 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image sensor chip provided with a pixel domain at a central portion of an upper surface thereof, a substrate disposed at an upper side of the image sensor chip so as to be flip-chip bonded with respect to the image sensor chip, provided with a hole formed at a position corresponding to the pixel domain, and formed of organic material, a printed circuit board at which the substrate provided with the image sensor chip bonded thereto is mounted, and a solder ball configured to electrically connect the substrate to the printed circuit board.

Abstract translation: 提供了能够在增强相对于物理冲击的可靠性的同时细长化的图像传感器封装和图像传感器芯片。 图像传感器封装包括在其上表面的中心部分处设置有像素域的图像传感器芯片，设置在图像传感器芯片的上侧的基板，以便相对于图像传感器进行倒装芯片接合 芯片，在与像素区域对应的位置形成有孔，由有机材料形成，安装了配置有图像传感器芯片的基板的印刷电路板，以及焊锡球， 基板到印刷电路板。

公开(公告)号：US20130285185A1

公开(公告)日：2013-10-31

申请号：US13870453

申请日：2013-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Sang PARK ,  Hyo Young Shin

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image sensor chip provided with a pixel domain at a central portion of an upper surface thereof, a substrate disposed at an upper side of the image sensor chip so as to be flip-chip bonded with respect to the image sensor chip, provided with a hole formed at a position corresponding to the pixel domain, and formed of organic material, a printed circuit board at which the substrate provided with the image sensor chip bonded thereto is mounted, and a solder ball configured to electrically connect the substrate to the printed circuit board.

Abstract translation: 提供能够在增强相对于物理冲击的可靠性的同时细长化的图像传感器封装和图像传感器芯片。 图像传感器封装包括在其上表面的中心部分处设置有像素域的图像传感器芯片，设置在图像传感器芯片的上侧的基板，以便相对于图像传感器进行倒装芯片接合 芯片，在与像素区域对应的位置形成有孔，由有机材料形成，安装了配置有图像传感器芯片的基板的印刷电路板，以及焊锡球， 基板到印刷电路板。