公开(公告)号：US20130248997A1

公开(公告)日：2013-09-26

申请号：US13787147

申请日：2013-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se-myeong Jang ,  Sang-hyun Han ,  Hyo-dong Ban

IPC: H01L27/088

CPC classification number: H01L27/088 ,  H01L21/823456 ,  H01L21/823481

Abstract: A semiconductor device includes a substrate partitioned into a cell region, a peripheral circuit region, and an interface region between the cell region and the peripheral circuit region. A guard ring is provided in the interface region of the substrate and surrounds the cell region. A first gate structure is in the cell region, and a second gate structure is in the peripheral circuit region.

Abstract translation: 半导体器件包括分隔成单元区域的基板，外围电路区域和单元区域与外围电路区域之间的接口区域。 保护环设置在基板的界面区域中并围绕单元区域。 第一栅极结构在单元区域中，第二栅极结构在外围电路区域中。

公开(公告)号：US08928073B2

公开(公告)日：2015-01-06

申请号：US13787147

申请日：2013-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se-myeong Jang ,  Sang-hyun Han ,  Hyo-dong Ban

IPC: H01L29/66 ,  H01L27/088 ,  H01L21/8234

CPC classification number: H01L27/088 ,  H01L21/823456 ,  H01L21/823481

Abstract: A semiconductor device includes a substrate partitioned into a cell region, a peripheral circuit region, and an interface region between the cell region and the peripheral circuit region. A guard ring is provided in the interface region of the substrate and surrounds the cell region. A first gate structure is in the cell region, and a second gate structure is in the peripheral circuit region.

Abstract translation: 半导体器件包括分隔成单元区域的基板，外围电路区域和单元区域与外围电路区域之间的接口区域。 保护环设置在基板的界面区域中并围绕单元区域。 第一栅极结构在单元区域中，第二栅极结构在外围电路区域中。