公开(公告)号：US09625949B2

公开(公告)日：2017-04-18

申请号：US14796514

申请日：2015-07-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Seok Lee ,  Tae-Hwan Kang ,  Hyun-Jun Kwon ,  Ki-Deuk Kim ,  Sang-Hyeon Kim ,  Jin-A Mock ,  Sung-Young Lee ,  Min-Su Jung ,  Hong-Moon Chun ,  Jung-Woong Hyun

IPC: G06F1/16 ,  H04M1/02 ,  H04M1/18

CPC classification number: H05K5/0217 ,  G06F1/1637 ,  G06F1/1658 ,  H04M1/0202 ,  H04M1/0277 ,  H04M1/185 ,  H05K5/0017 ,  H05K5/0247 ,  H05K7/1427

Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.

公开(公告)号：US10201102B2

公开(公告)日：2019-02-05

申请号：US15457246

申请日：2017-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Seok Lee ,  Tae-Hwan Kang ,  Hyun-Jun Kwon ,  Ki-Deuk Kim ,  Sang-Hyeon Kim ,  Jin-A Mock ,  Sung-Young Lee ,  Min-Su Jung ,  Hong-Moon Chun ,  Jung Woong Hyun

IPC: H05K5/02 ,  G06F1/16 ,  H04M1/02 ,  H04M1/18 ,  H05K5/00 ,  H05K7/14

Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.

公开(公告)号：US10462917B2

公开(公告)日：2019-10-29

申请号：US16232686

申请日：2018-12-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Seok Lee ,  Tae-Hwan Kang ,  Hyun-Jun Kwon ,  Ki-Deuk Kim ,  Sang-Hyeon Kim ,  Jin-A Mock ,  Sung-Young Lee ,  Min-Su Jung ,  Hong-Moon Chun ,  Jung Woong Hyun

IPC: H05K5/02 ,  G06F1/16 ,  H04M1/02 ,  H04M1/18 ,  H05K5/00 ,  H05K7/14

Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.