Abstract:
A bubble-jet type ink-jet printhead, a manufacturing method thereof and a method of ejecting ink, wherein, in the printhead, a manifold supplying ink, a hemispherical ink chamber, and an ink channel for connecting the manifold with the ink chamber are integrally formed on the substrate. A nozzle plate on the substrate having a nozzle, and a heater formed in an annular shape and centered around the nozzle are integrated without a complex process such as bonding. Thus, this simplifies the manufacturing process and facilitates high volume production. Furthermore, according to the ink ejection method, a doughnut-shaped bubble is formed to eject ink, thereby preventing a back flow of ink as well as formation of satellite droplets that may degrade image resolution.
Abstract:
A bubble-jet type ink-jet printhead, and a manufacturing method thereof are provided, wherein, the printhead includes a substrate integrally having an ink supply manifold, an ink chamber, and an ink channel, a nozzle plate having a nozzle, a heater consisting of resistive heating elements, and an electrode for applying current to the heater. In particular, the ink chamber is formed in a substantially hemispherical shape on a surface of the substrate, a manifold is formed from its bottom side toward the ink chamber, and the ink channel linking the manifold and the ink chamber is formed at the bottom of the ink chamber. Thus, this simplifies the manufacturing process and facilitates high integration and high volume production. Furthermore, a doughnut-shaped bubble is formed to eject ink in the printhead, thereby preventing a back flow of ink as well as formation of satellite droplets that may degrade image resolution.
Abstract:
A bubble-jet type ink-jet printhead, and a manufacturing method thereof are provided, wherein, the printhead includes a substrate integrally having an ink supply manifold, an ink chamber, and an ink channel, a nozzle plate having a nozzle, a heater consisting of resistive heating elements, and an electrode for applying current to the heater. In particular, the ink chamber is formed in a substantially hemispherical shape on a surface of the substrate, a manifold is formed from its bottom side toward the ink chamber, and the ink channel linking the manifold and the ink chamber is formed at the bottom of the ink chamber. Thus, this simplifies the manufacturing process and facilitates high integration and high volume production. Furthermore, a doughnut-shaped bubble is formed to eject ink in the printhead, thereby preventing a back flow of ink as well as formation of satellite droplets that may degrade image resolution.
Abstract:
A monolithic nozzle assembly for fluid, and a method for manufacturing the same with a single mono-crystalline silicon wafer by continuous self-alignment are provided. The monolithic nozzle assembly can be formed with a single (100) monocrystalline silicon wafer. Compared with a complicated nozzle assembly formed using a great number of silicon wafers and plates, the configuration of the monolithic nozzle assembly is simple, and can be manufactured on a mass production scale by semiconductor manufacturing processes. The monolithic nozzle assembly can be manufactured by continuous self-alignment, including anisotropic etching using the characteristic of the crystal plane of silicon, and LOCOS-based masking. Compared with a common photolithography process, the alignment error may be reduced below a few microns. The overall manufacturing process is simple and efficient with a high yield.