公开(公告)号：US20010028378A1

公开(公告)日：2001-10-11

申请号：US09790714

申请日：2001-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-sung Lee ,  Hyun-cheol Kim ,  Yong-soo Oh ,  Cimoo Song

IPC: B41J002/05

CPC classification number: B41J2/1433 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642

Abstract: A monolithic nozzle assembly for fluid, and a method for manufacturing the same with a single mono-crystalline silicon wafer by continuous self-alignment are provided. The monolithic nozzle assembly can be formed with a single (100) monocrystalline silicon wafer. Compared with a complicated nozzle assembly formed using a great number of silicon wafers and plates, the configuration of the monolithic nozzle assembly is simple, and can be manufactured on a mass production scale by semiconductor manufacturing processes. The monolithic nozzle assembly can be manufactured by continuous self-alignment, including anisotropic etching using the characteristic of the crystal plane of silicon, and LOCOS-based masking. Compared with a common photolithography process, the alignment error may be reduced below a few microns. The overall manufacturing process is simple and efficient with a high yield.

Abstract translation: 提供了用于流体的单片式喷嘴组件及其通过连续自对准用单个单晶硅晶片制造该方法。 单片喷嘴组件可以由单个（100）单晶硅晶片形成。 与使用大量硅晶片和板形成的复杂喷嘴组件相比，单片喷嘴组件的构造简单，并且可以通过半导体制造工艺在大规模生产规模上制造。 单片喷嘴组件可以通过连续自对准（包括使用硅的晶面的特性的各向异性蚀刻）和基于LOCOS的掩模来制造。 与普通光刻工艺相比，对准误差可能会降低到几微米以下。 整体制造工艺简单高效，成品率高。

公开(公告)号：US20030183887A1

公开(公告)日：2003-10-02

申请号：US10384495

申请日：2003-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L021/00 ,  H01L027/14 ,  H01L029/82

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

Abstract translation: 一种用于制造具有固定到基板上的固定部件，连接部件，驱动部件，驱动电极和接触部件的MEMS器件的方法，包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 平坦化金属层直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口，从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分，使得牺牲层的一部分保留在固定区域中。

公开(公告)号：US20030122205A1

公开(公告)日：2003-07-03

申请号：US10320679

申请日：2002-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-sung Lee ,  Moon-chul Lee ,  Hyun-ok Kim

IPC: H01L027/14

CPC classification number: B81B3/0078 ,  B81B2203/0307 ,  B81C2201/0109

Abstract: A fabrication method for a MEMS structure, the MEMS structure including a fixing portion fixed to the substrate and a floating portion floating above the substrate. A sacrificial layer deposited on the substrate is patterned to have a groove forming a space surrounding the area corresponding to the area in which the fixing portion is to be formed. If the MEMS structure is deposited on the sacrificial layer, a sidewall is formed inside the space and the fixing portion and the floating portion are formed on the sacrificial layer. If the sacrificial layer is removed using an etchant, the sacrificial layer at the bottom of the fixing portion is protected from the etchant by the sidewall and accordingly, the sacrificial layer except the area surrounded by the sidewall is removed. Therefore, only the sacrificial layer under the floating portion is removed. Because the connecting portion is fabricated to have the same thickness as the fixing portion and the floating portion, a strong/durable MEMS structure is provided. Additionally, the boundary between the fixing portion and the floating portion can be precisely determined, and adjustment of the length of the floating portion can be precisely controlled.

Abstract translation: 一种用于MEMS结构的制造方法，所述MEMS结构包括固定到所述基板的固定部分和浮置在所述基板上方的浮动部分。 沉积在基板上的牺牲层被图案化以具有形成围绕与要形成固定部分的区域相对应的区域的空间的凹槽。 如果MEMS结构沉积在牺牲层上，则在空间内形成侧壁，并且在牺牲层上形成固定部分和浮动部分。 如果使用蚀刻剂去除牺牲层，则固定部分底部的牺牲层被侧壁保护而不受蚀刻剂的影响，因此除去由侧壁包围的区域之外的牺牲层。 因此，只有在浮动部分下面的牺牲层被去除。 由于连接部分被制造成具有与固定部分和浮动部分相同的厚度，所以提供了强/耐久的MEMS结构。 此外，可以精确地确定固定部分和浮动部分之间的边界，并且可以精确地控制浮动部分的长度的调节。

公开(公告)号：US20040231584A1

公开(公告)日：2004-11-25

申请号：US10797579

申请日：2004-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-sung Lee ,  Sung-hoon Choa ,  Min-seog Choi

IPC: B05C013/00

CPC classification number: H01L21/6715

Abstract: A spin coating apparatus for coating photoresist has a spin chuck and a nozzle part. The spin chuck has a mount part on which a wafer is mounted and an extended projection part on which edge-bead is formed. The nozzle part is for depositing photoresist onto the wafer mounted on the mount part of the spin chuck. By using the spin coating apparatus, edge-bead is formed on the extended projection part, and not on the wafer.

Abstract translation: 用于涂覆光致抗蚀剂的旋涂装置具有旋转卡盘和喷嘴部分。 旋转卡盘具有其上安装有晶片的安装部分和形成有边缘珠的延伸突起部分。 喷嘴部分用于将光致抗蚀剂沉积到安装在旋转卡盘的安装部分上的晶片上。 通过使用旋涂装置，在延伸的突出部分上而不是在晶片上形成边缘珠。

公开(公告)号：US20040155306A1

公开(公告)日：2004-08-12

申请号：US10773312

申请日：2004-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L027/14

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

Abstract translation: 一种用于制造具有固定到基板上的固定部件，连接部件，驱动部件，驱动电极和接触部件的MEMS器件的方法，包括在所述基板上图形化所述驱动电极; 在所述基板上形成绝缘层; 图案化绝缘层并蚀刻绝缘层的固定区域和接触区域; 在衬底上形成金属层; 使金属层平坦化直到绝缘层露出; 在所述基板上形成牺牲层; 图案化牺牲层以形成露出固定区域中绝缘层和金属层的一部分的开口; 在所述牺牲层上形成MEMS结构层以部分地填充所述开口，从而在其中形成侧壁; 并且通过蚀刻选择性地去除牺牲层的一部分，使得牺牲层的一部分保留在固定区域中。