公开(公告)号：US20230420285A1

公开(公告)日：2023-12-28

申请号：US18314983

申请日：2023-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Jun Choi ,  Tae Hong Min

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/6838 ,  H01L21/68742 ,  H01L21/67288

Abstract: A substrate processing apparatus includes: a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate; and a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure. The plurality of pins include a plurality of first pins in the first region and are configured to be elevated at the same time, and a plurality of second pins in the second region and are configured to be elevated at the same time. In operation, the first pins are elevated and adsorb the substrate first, and then, the second pins are elevated and adsorb the substrate.