公开(公告)号：US09496163B2

公开(公告)日：2016-11-15

申请号：US14505774

申请日：2014-10-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： HyungJun Jeon ,  Byung Lyul Park ,  Jisoon Park

IPC: H01L23/495 ,  H01L21/683 ,  H01L21/304 ,  H01L21/768

CPC classification number: H01L21/6835 ,  H01L21/304 ,  H01L21/6836 ,  H01L21/76898 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a carrier and a method of fabricating a semiconductor device using the same. The carrier may include a recess region provided adjacent to an edge thereof. The recess region may be configured to confine an adhesive layer within a desired region including the recess region. The recess region makes it possible to reduce a process failure in a process of fabricating a semiconductor device.

Abstract translation: 提供一种使用其制造半导体器件的载体和方法。 载体可以包括邻近其边缘设置的凹陷区域。 凹部区域可以被配置为将粘合剂层限制在包括凹部区域的期望区域内。 凹部区域可以减少制造半导体器件的工艺过程中的故障。