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1.发明授权公开(公告)号：US11568949B2
公开(公告)日：2023-01-31
申请号：US17018418
申请日：2020-09-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyungsuk Yu , Hyukje Kwon , Jisoo Choi
Abstract: A method of testing a semiconductor package including a plurality of semiconductor chips includes sensing electrical signals respectively output from a plurality of semiconductor chip groups each representing a combination of at least two semiconductor chips among the plurality of semiconductor chips, obtaining amplitudes of electrical signals respectively output from the plurality of semiconductor chips based on the plurality of sensed electrical signals, and outputting a test result for the semiconductor package by using the plurality of obtained electrical signals.
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2.发明申请公开(公告)号：US20210265000A1
公开(公告)日：2021-08-26
申请号：US17018418
申请日：2020-09-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyungsuk Yu , Hyukje Kwon , Jisoo Choi
Abstract: A method of testing a semiconductor package including a plurality of semiconductor chips includes sensing electrical signals respectively output from a plurality of semiconductor chip groups each representing a combination of at least two semiconductor chips among the plurality of semiconductor chips, obtaining amplitudes of electrical signals respectively output from the plurality of semiconductor chips based on the plurality of sensed electrical signals, and outputting a test result for the semiconductor package by using the plurality of obtained electrical signals.
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