公开(公告)号：US20240392426A1

公开(公告)日：2024-11-28

申请号：US18430308

申请日：2024-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younseon WANG ,  Jeonghoon NAM ,  Youngkwon KIM ,  Hyunseo CHOI ,  Keonwoo KIM ,  Dougyong SUNG ,  Junho IM

IPC: C23C8/36 ,  C23C8/80 ,  C23C16/44 ,  H01J37/32

Abstract: A method of surface treatment, includes: providing a component in a first process chamber; generating fluorine plasma with a remote plasma source connected to the first process chamber; and forming a protective layer on a surface of the component by providing the fluorine plasma to the first process chamber, wherein the protective layer comprises magnesium fluoride, wherein a magnesium content of the component is about 0.5 wt % to about 5.5 wt %, and wherein a thickness of the protective layer is about 100 nm to about 300 nm.