公开(公告)号：US20240213071A1

公开(公告)日：2024-06-27

申请号：US18396553

申请日：2023-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junho IM ,  Younseon Wang ,  Yongwoo Kim ,  Taehwa Kim ,  Inseok Seo ,  Kiseok Lee

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01J37/32715

Abstract: An electrostatic chuck includes an electrostatic chuck body having a step portion protruding from a lower end, an adhesive layer disposed on an upper surface of the electrostatic chuck body, a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body, and a sealant disposed between the step portion and the edge of the ceramic puck and configured to block reaction gas from permeating into the adhesive layer. The sealant includes a coating layer disposed on an external surface thereof, and the coating layer includes a metal oxide including a single rare earth oxide and/or a multilayer heterogeneous metal oxide.

公开(公告)号：US20240392426A1

公开(公告)日：2024-11-28

申请号：US18430308

申请日：2024-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younseon WANG ,  Jeonghoon NAM ,  Youngkwon KIM ,  Hyunseo CHOI ,  Keonwoo KIM ,  Dougyong SUNG ,  Junho IM

IPC: C23C8/36 ,  C23C8/80 ,  C23C16/44 ,  H01J37/32

Abstract: A method of surface treatment, includes: providing a component in a first process chamber; generating fluorine plasma with a remote plasma source connected to the first process chamber; and forming a protective layer on a surface of the component by providing the fluorine plasma to the first process chamber, wherein the protective layer comprises magnesium fluoride, wherein a magnesium content of the component is about 0.5 wt % to about 5.5 wt %, and wherein a thickness of the protective layer is about 100 nm to about 300 nm.