公开(公告)号：US20210025832A1

公开(公告)日：2021-01-28

申请号：US16846978

申请日：2020-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Heung AHN ,  Racine NASSAU ,  Su Hwan PARK ,  Ki Wan SEO ,  Nam Il KOO ,  In Keun BAEK ,  Jong Min YOON ,  Ik Seon JEON

IPC: G01N21/95

Abstract: Provided is an apparatus for measuring a wafer. The apparatus may include a chuck disposed on a stage and a plate connected with the stage, a horizontal frame configured to support a wafer, and a vertical frame connecting the plate and the horizontal frame. The apparatus may further include first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer, a support bar penetrating through the chuck and extending in a first direction and a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer. The apparatus may further include a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer.