公开(公告)号：US20180164227A1

公开(公告)日：2018-06-14

申请号：US15800338

申请日：2017-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taejoong KIM ,  Kwang Soo KIM ,  lwa YOICHIRO ,  Byeonghwan JEON ,  Yougduk KIM ,  Wansung PARK ,  Tae-Heung AHN ,  Jaechol JOO

IPC: G01N21/94 ,  G01B11/06

CPC classification number: G01N21/94 ,  G01B11/06 ,  G01N21/9501 ,  G01N21/956

Abstract: Disclosed is a substrate inspection system. The substrate inspection system comprises a substrate inspection apparatus that inspects a substrate by irradiating light thereto. The substrate inspection apparatus comprises a light source to irradiate light onto the substrate, a detector to receive light from the substrate, and a controller to control an inspection mode of the substrate inspection apparatus by controlling the light source and the detector. The inspection mode comprises a first inspection mode to inspect whether a particle is present on the substrate and a second inspection mode to inspect a thickness of the substrate.

公开(公告)号：US20210025832A1

公开(公告)日：2021-01-28

申请号：US16846978

申请日：2020-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Heung AHN ,  Racine NASSAU ,  Su Hwan PARK ,  Ki Wan SEO ,  Nam Il KOO ,  In Keun BAEK ,  Jong Min YOON ,  Ik Seon JEON

IPC: G01N21/95

Abstract: Provided is an apparatus for measuring a wafer. The apparatus may include a chuck disposed on a stage and a plate connected with the stage, a horizontal frame configured to support a wafer, and a vertical frame connecting the plate and the horizontal frame. The apparatus may further include first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer, a support bar penetrating through the chuck and extending in a first direction and a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer. The apparatus may further include a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer.