公开(公告)号：US10195715B2

公开(公告)日：2019-02-05

申请号：US14988367

申请日：2016-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-Kwon Kim ,  Kyung-Hyun Kim ,  Ki-Jong Park ,  Ki-Ho Bae ,  Jong-Heun Lim

IPC: B24B37/30 ,  B24B37/10 ,  B24B37/04 ,  B24B37/32

Abstract: A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.

公开(公告)号：US09254546B2

公开(公告)日：2016-02-09

申请号：US14045157

申请日：2013-10-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-Kwon Kim ,  Kyung-Hyun Kim ,  Ki-Jong Park ,  Ki-Ho Bae ,  Jong-Heun Lim

IPC: B24B37/30 ,  B24B37/32 ,  B24B37/10 ,  B24B37/04

CPC classification number: B24B37/30 ,  B24B37/042 ,  B24B37/10 ,  B24B37/32

Abstract: A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.

Abstract translation: 化学机械抛光机包括抛光头组件，其包括抛光头本体和设置在抛光头本体底部的膜。 膜的底表面包括疏水区域和亲水区域。