公开(公告)号：US20230197402A1

公开(公告)日：2023-06-22

申请号：US17891204

申请日：2022-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： YUJIN CHO ,  JONGHYUK KANG ,  INHYE PARK ,  SUYOUNG LEE ,  CHUNGSAM JUN ,  HONGCHE NOH ,  JANGHEE LEE

IPC: H01J37/28 ,  H01J37/244 ,  H01J37/26 ,  H01J37/147

CPC classification number: H01J37/28 ,  H01J37/244 ,  H01J37/265 ,  H01J37/1471 ,  H01J2237/2817 ,  H01J2237/0048 ,  H01J2237/24592

Abstract: Disclosed are semiconductor inspection apparatuses and methods. The semiconductor inspection apparatus comprises a stage that supports a semiconductor device, a first column that irradiates a first electron beam toward the semiconductor device on the stage, a second column that irradiates a second electron beam toward the semiconductor device, and a detector that detects a secondary electron generated by the second electron beam. The first column is disposed to make a first angle with a top surface of the semiconductor device. The second column is disposed to make a second angle with the top surface of the semiconductor device. The first angle and the second angle are different from each other.