公开(公告)号：US20230197402A1

公开(公告)日：2023-06-22

申请号：US17891204

申请日：2022-08-19

申请人： Samsung Electronics Co., Ltd.

发明人： YUJIN CHO ,  JONGHYUK KANG ,  INHYE PARK ,  SUYOUNG LEE ,  CHUNGSAM JUN ,  HONGCHE NOH ,  JANGHEE LEE

IPC分类号： H01J37/28 ,  H01J37/244 ,  H01J37/26 ,  H01J37/147

CPC分类号： H01J37/28 ,  H01J37/244 ,  H01J37/265 ,  H01J37/1471 ,  H01J2237/2817 ,  H01J2237/0048 ,  H01J2237/24592

摘要： Disclosed are semiconductor inspection apparatuses and methods. The semiconductor inspection apparatus comprises a stage that supports a semiconductor device, a first column that irradiates a first electron beam toward the semiconductor device on the stage, a second column that irradiates a second electron beam toward the semiconductor device, and a detector that detects a secondary electron generated by the second electron beam. The first column is disposed to make a first angle with a top surface of the semiconductor device. The second column is disposed to make a second angle with the top surface of the semiconductor device. The first angle and the second angle are different from each other.

公开(公告)号：US20230266258A1

公开(公告)日：2023-08-24

申请号：US18113121

申请日：2023-02-23

申请人： Samsung Electronics Co., Ltd.

发明人： INHYE PARK ,  SUYOUNG LEE ,  YUJIN CHO ,  JONG CHEON SUN ,  CHUNGSAM JUN

IPC分类号： G01N23/2251

CPC分类号： G01N23/2251 ,  G01N2223/6116 ,  G01N2223/646

摘要： A method of inspecting a semiconductor device includes charging an inspection region of a semiconductor device using a charging electron beam, and scanning the inspection region using a scanning electron beam. The charging of the inspection region includes dividing the inspection region into a charging region and a non-charging region, and charging the charging region using the charging electron beam. The scanning of the inspection region includes irradiating the scanning electron beam to the inspection region, and detecting secondary electrons emitted from the inspection region by the scanning electron beam.