公开(公告)号：US20230132272A1

公开(公告)日：2023-04-27

申请号：US17870898

申请日：2022-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： JUN YOUNG OH ,  UN-BYOUNG KANG ,  BYEONGCHAN KIM ,  JUMYONG PARK ,  CHUNGSUN LEE

IPC: H01L23/00 ,  H01L25/065

Abstract: The semiconductor device may include a substrate, a first insulating layer on a bottom surface of the substrate, an interconnection structure in the first insulating layer, a second insulating layer on a bottom surface of the first insulating layer, and a plurality of lower pads provided in the second insulating layer. Each lower pad may be provided such a width of a top surface thereof is smaller than a width of a bottom surface thereof. The lower pads may include first, second, and third lower pads. In a plan view, the first and third lower pads may be adjacent to center and edge portions of the substrate, respectively, and the second lower pad may be disposed therebetween. A width of a bottom surface of the second lower pad may be smaller than that of the first lower pad and may be larger than that of the third lower pad.

公开(公告)号：US20210366832A1

公开(公告)日：2021-11-25

申请号：US17392705

申请日：2021-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JONGHO PARK ,  SEUNG HWAN KIM ,  JUN YOUNG OH ,  Kyong Hwan KOH ,  SANGSOO KIM ,  DONG-JU JANG

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/16 ,  H01L23/31

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.